XC3SD1800A-4FGG676C

The XC3SD1800A-4FGG676C is a Spartan®-3A DSP field programmable gate array from AMD. It delivers a balance of programmable logic, on-chip memory, and extensive I/O in a compact 676‑ball BGA package for DSP-centric and I/O‑rich designs.

With 37,440 logic elements, approximately 1.55 Mbits of embedded memory, and up to 519 I/O, this device is suited to applications that require significant on-chip logic, embedded RAM, and large external connectivity while operating from a 1.14 V to 1.26 V supply across commercial temperature ranges.

Key Features

• Core Logic 37,440 logic elements (cells) provide substantial programmable logic capacity for complex finite-state machines, custom datapaths, and control logic.
• Embedded Memory Approximately 1.55 Mbits of total on-chip RAM to support buffering, FIFOs, and working datasets for DSP and control tasks.
• DSP‑Oriented Design Manufactured and marketed as a Spartan-3A DSP FPGA, targeted toward signal processing and compute-oriented programmable logic implementations.
• High I/O Count 519 user I/O pins accommodate wide parallel buses, multiple interfaces, and extensive sensor/actuator connectivity.
• Performance Density Around 1,800,000 gates of logic capacity for mid-range FPGA integration needs.
• Package and Mounting 676‑BGA (676‑FBGA, 27×27) surface-mount package provides a compact footprint with high pin density for board-level integration.
• Power and Temperature Operates from a 1.14 V to 1.26 V core supply and is specified for commercial temperature operation from 0 °C to 85 °C.
• Compliance RoHS compliant for environmental regulation conformity.

Typical Applications

• DSP and Signal Processing — On-chip memory and DSP-focused architecture support real-time filtering, FFTs, and other signal-processing tasks.
• High‑Density I/O Systems — 519 I/O pins enable parallel interfaces, multi-channel data acquisition, and connectivity to numerous peripherals.
• Embedded Control and Data Handling — Logic capacity and embedded RAM suit control systems, protocol handling, and packet buffering.
• Custom Logic and Glue Logic — Use as a programmable hub to integrate multiple subsystems and offload bespoke logic from processors.

Unique Advantages

• Significant Logic Capacity: 37,440 logic elements enable integration of complex state machines and moderate compute blocks on a single device.
• Substantial On‑Chip Memory: Approximately 1.55 Mbits of RAM reduces dependence on external memory for buffering and intermediate data storage.
• Extensive I/O: 519 I/O pins support broad connectivity options for sensors, interfaces, and parallel data streams.
• Compact, High‑Pin‑Count Package: The 676‑BGA (27×27) package allows a high-density board layout while keeping the PCB footprint manageable.
• Tight Power Specification: Defined core supply range of 1.14 V to 1.26 V enables predictable power planning during system design.
• RoHS Compliant: Meets common environmental requirements for modern electronics production.

Why Choose XC3SD1800A-4FGG676C?

The XC3SD1800A-4FGG676C positions itself as a mid-range, DSP-focused FPGA combining sizable programmable logic, on-chip RAM, and a very high I/O count in a single 676‑BGA package. It is well suited to engineers designing DSP algorithms, complex interface logic, or systems that require integrated memory and extensive external connectivity within commercial temperature environments.

Provided by AMD, this device offers a clear specification set—logic capacity, memory, I/O, package, supply voltage, and operating temperature—that supports predictable integration and scalability for embedded and signal-processing projects.

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