XC3S700AN-5FGG484C

The XC3S700AN-5FGG484C is a Spartan®-3AN Field Programmable Gate Array (FPGA) IC that delivers a balance of programmable logic, embedded memory, and I/O capacity in a compact BGA package. It integrates 13,248 logic elements, approximately 0.369 Mbits of on-chip RAM, and 372 user I/O, making it suitable for designs requiring significant logic and I/O resources within a commercial-grade device.

This surface-mount FPGA operates from a core supply range of 1.14 V to 1.26 V and is specified for operation between 0 °C and 85 °C. The device is RoHS compliant and packaged in a 484-pin BGA (supplier package: 484-FBGA, 23×23).

Key Features

• Core Logic  Provides 1,472 configurable logic blocks (CLBs) and 13,248 logic elements for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.369 Mbits of total on-chip RAM for buffering, FIFOs, and small data stores.
• I/O Capacity  372 user I/O pins to support parallel interfaces, control signals, and board-level connectivity.
• Gate Count  Approximately 700,000 gates enabling moderate-complexity designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match board power domains.
• Package & Mounting  484-BBGA package (supplier: 484-FBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Operating Range  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for environmental regulatory requirements.

Unique Advantages

• Substantial logic density: 13,248 logic elements provide the capacity for moderate-complexity programmable designs without excessive board-level resources.
• Balanced on-chip memory: Approximately 0.369 Mbits of embedded RAM supports buffering and data-path needs within the FPGA fabric.
• High I/O count: 372 I/O pins enable extensive external interfacing and parallel connectivity options.
• Compact package: 484-BBGA (484-FBGA, 23×23) offers a small footprint for space-constrained PCBs while maintaining robust pin count.
• Commercial-grade reliability: Specified 0 °C to 85 °C operating range and surface-mount packaging for standard commercial applications.
• Regulatory alignment: RoHS compliance supports environmentally conscious designs and procurement.

Why Choose XC3S700AN-5FGG484C?

The XC3S700AN-5FGG484C Spartan‑3AN FPGA combines a substantial logic element count, embedded memory, and extensive I/O in a compact 484‑pin BGA package. Its specifications make it a practical choice for developers and procurement teams seeking a commercial‑grade, RoHS‑compliant FPGA with defined power and temperature envelopes.

This device is well suited to projects that require a measured combination of programmable logic, on‑chip RAM, and multiple I/O lines delivered in a surface‑mount BGA form factor, providing predictable platform resources and integration for mid-range digital designs.

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