XC3S700AN-4FGG484C

The XC3S700AN-4FGG484C is a Spartan®-3AN field programmable gate array (FPGA) from AMD. It integrates 13,248 logic elements, approximately 0.37 Mbits of embedded memory, and 372 user I/O in a compact 484-ball BGA package.

Designed for surface-mount assembly and commercial-grade deployment, this device operates from a 1.14 V to 1.26 V core supply and across a 0 °C to 85 °C ambient temperature range, providing a balanced combination of logic density, on-chip memory, and I/O capacity.

Key Features

• Core Logic  13,248 logic elements and an estimated 700,000 gates provide the programmable fabric for custom logic implementation.
• Embedded Memory  Approximately 368,640 bits (≈0.37 Mbits) of on-chip RAM to support buffering, state storage, and local data handling.
• I/O Capacity  372 user I/O pins to support diverse peripheral interfacing and multi-signal connectivity.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA (23×23)), optimized for surface-mount PCB assembly.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Substantial logic density: 13,248 logic elements and ~700,000 gates enable implementation of moderately complex digital functions without external logic.
• On-chip memory: Approximately 0.37 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• High I/O count: 372 user I/O pins allow broad peripheral connectivity and signal routing directly to the FPGA.
• Compact BGA footprint: 484-BBGA (484-FBGA, 23×23) package supports high-density PCB layouts while maintaining surface-mount compatibility.
• Low-voltage core: Narrow core supply range (1.14 V–1.26 V) aids in predictable power delivery design.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC3S700AN-4FGG484C?

Manufactured by AMD, the XC3S700AN-4FGG484C offers a combination of logic resources, embedded memory, and a large I/O set in a compact 484-ball BGA package. These characteristics make it suitable for designs that require integrated programmable logic, on-chip RAM, and substantial peripheral connectivity within a commercial temperature range.

With RoHS compliance and a defined core voltage and temperature specification, this FPGA provides a verifiable hardware baseline for procurement and system integration where the stated electrical, thermal, and packaging parameters align with project requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S700AN-4FGG484C.