XC3SD1800A-4CS484LI

IC FPGA 309 I/O 484CSBGA
Part Description

Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 309 1548288 37440 484-FBGA, CSPBGA

Quantity 1,308 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-CSPBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGA, CSPBGANumber of I/O309Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4160Number of Logic Elements/Cells37440
Number of Gates1800000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1548288

Overview of XC3SD1800A-4CS484LI – Spartan®-3A DSP FPGA, 37,440 Logic Elements

The XC3SD1800A-4CS484LI is a Spartan®-3A DSP field programmable gate array (FPGA) designed for industrial applications. It combines a large configurable logic capacity with on-chip memory and extensive I/O to support complex digital signal processing and embedded logic functions.

This device is supplied in a 484-ball CSPBGA package and operates over an extended industrial temperature range, offering a balance of integration and reliability for embedded and DSP-focused designs.

Key Features

  • Core Architecture  4,160 configurable logic blocks (CLBs) providing a total of 37,440 logic elements for implementing complex digital logic and DSP algorithms.
  • Embedded Memory  Approximately 1.55 Mbits of on-chip RAM (1,548,288 total RAM bits) to support data buffering, lookup tables, and on-chip storage.
  • I/O Capacity  309 user I/O pins to interface with peripherals, sensors, and external memory devices.
  • Logic Scale  Equivalent to approximately 1,800,000 logic gates for medium-to-large FPGA designs.
  • Power  Core supply range from 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
  • Package & Mounting  484-ball CSPBGA (484-FBGA) package, supplier device package 484-CSPBGA (19×19), designed for surface mount assembly.
  • Temperature Range  Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Regulatory  RoHS compliant for reduced hazardous substance content.

Typical Applications

  • Digital Signal Processing (DSP)  Implement filtering, transforms, and other DSP functions leveraging the device’s DSP-oriented architecture and on-chip memory.
  • Embedded Logic and Control  Integrate custom control logic and state machines where a large number of logic elements and plentiful I/O are required.
  • Data Buffering and Protocol Bridging  Use the on-chip RAM and abundant I/O to buffer streams and bridge between digital interfaces in industrial systems.

Unique Advantages

  • Significant logic capacity: 37,440 logic elements enable implementation of complex custom logic and DSP functions without immediate need for external processors.
  • Substantial embedded memory: Approximately 1.55 Mbits of on-chip RAM reduces reliance on external memory for many buffering and processing tasks.
  • High I/O count: 309 I/O pins simplify connectivity to peripherals, sensors, and interface circuitry, reducing board-level complexity.
  • Industrial temperature rating: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
  • Compact, surface-mount packaging: 484-CSPBGA (19×19) package supports high-density board designs while maintaining robust mounting characteristics.
  • RoHS compliant: Meets reduced hazardous substance requirements for regulated supply chains.

Why Choose XC3SD1800A-4CS484LI?

The XC3SD1800A-4CS484LI positions itself as a high-capacity Spartan®-3A DSP FPGA that combines a large number of logic elements with substantial on-chip RAM and a high pin count, delivered in a compact 484-ball CSPBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and DSP-centric designs where reliability and integration are priorities.

This device is well suited for engineers and procurement teams designing medium-to-large FPGA-based systems that require significant logic and memory resources, flexible I/O, and industrial-grade operating range. Its specification set supports scalable designs that balance performance with integration.

Request a quote or submit an inquiry today to get pricing and availability for the XC3SD1800A-4CS484LI.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up