XC3SD1800A-4CS484LI
| Part Description |
Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 309 1548288 37440 484-FBGA, CSPBGA |
|---|---|
| Quantity | 1,308 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CSPBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, CSPBGA | Number of I/O | 309 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4160 | Number of Logic Elements/Cells | 37440 | ||
| Number of Gates | 1800000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1548288 |
Overview of XC3SD1800A-4CS484LI – Spartan®-3A DSP FPGA, 37,440 Logic Elements
The XC3SD1800A-4CS484LI is a Spartan®-3A DSP field programmable gate array (FPGA) designed for industrial applications. It combines a large configurable logic capacity with on-chip memory and extensive I/O to support complex digital signal processing and embedded logic functions.
This device is supplied in a 484-ball CSPBGA package and operates over an extended industrial temperature range, offering a balance of integration and reliability for embedded and DSP-focused designs.
Key Features
- Core Architecture 4,160 configurable logic blocks (CLBs) providing a total of 37,440 logic elements for implementing complex digital logic and DSP algorithms.
- Embedded Memory Approximately 1.55 Mbits of on-chip RAM (1,548,288 total RAM bits) to support data buffering, lookup tables, and on-chip storage.
- I/O Capacity 309 user I/O pins to interface with peripherals, sensors, and external memory devices.
- Logic Scale Equivalent to approximately 1,800,000 logic gates for medium-to-large FPGA designs.
- Power Core supply range from 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
- Package & Mounting 484-ball CSPBGA (484-FBGA) package, supplier device package 484-CSPBGA (19×19), designed for surface mount assembly.
- Temperature Range Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Regulatory RoHS compliant for reduced hazardous substance content.
Typical Applications
- Digital Signal Processing (DSP) Implement filtering, transforms, and other DSP functions leveraging the device’s DSP-oriented architecture and on-chip memory.
- Embedded Logic and Control Integrate custom control logic and state machines where a large number of logic elements and plentiful I/O are required.
- Data Buffering and Protocol Bridging Use the on-chip RAM and abundant I/O to buffer streams and bridge between digital interfaces in industrial systems.
Unique Advantages
- Significant logic capacity: 37,440 logic elements enable implementation of complex custom logic and DSP functions without immediate need for external processors.
- Substantial embedded memory: Approximately 1.55 Mbits of on-chip RAM reduces reliance on external memory for many buffering and processing tasks.
- High I/O count: 309 I/O pins simplify connectivity to peripherals, sensors, and interface circuitry, reducing board-level complexity.
- Industrial temperature rating: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
- Compact, surface-mount packaging: 484-CSPBGA (19×19) package supports high-density board designs while maintaining robust mounting characteristics.
- RoHS compliant: Meets reduced hazardous substance requirements for regulated supply chains.
Why Choose XC3SD1800A-4CS484LI?
The XC3SD1800A-4CS484LI positions itself as a high-capacity Spartan®-3A DSP FPGA that combines a large number of logic elements with substantial on-chip RAM and a high pin count, delivered in a compact 484-ball CSPBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and DSP-centric designs where reliability and integration are priorities.
This device is well suited for engineers and procurement teams designing medium-to-large FPGA-based systems that require significant logic and memory resources, flexible I/O, and industrial-grade operating range. Its specification set supports scalable designs that balance performance with integration.
Request a quote or submit an inquiry today to get pricing and availability for the XC3SD1800A-4CS484LI.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








