XC3S700A-5FGG484C

The XC3S700A-5FGG484C is a Spartan-3A Field Programmable Gate Array (FPGA) manufactured by AMD. It provides on-chip programmable logic and memory resources in a 484-BBGA package, with characteristics suitable for commercial embedded designs.

Key on-chip resources include 13,248 logic elements, approximately 0.369 Mbits of embedded RAM, and 372 user I/O pins. The device operates from a 1.14 V to 1.26 V supply and is specified for 0 °C to 85 °C ambient temperature.

Key Features

• Logic Capacity — 13,248 logic elements and 1,472 configurable logic blocks (CLBs) provide substantial programmable logic resources for custom digital designs.
• On‑Chip Memory — Approximately 0.369 Mbits (368,640 bits) of embedded RAM for buffering, state storage, and local data processing.
• I/O — 372 user I/O pins support broad connectivity to peripherals, interfaces, and external devices.
• Gate Equivalent — Equivalent to 700,000 gates, enabling complex combinational and sequential logic implementations.
• Power — Core supply specified from 1.14 V to 1.26 V to match system power domains and design requirements.
• Package — 484-ball BGA (484-BBGA; supplier device package 484-FBGA, 23 × 23) for a compact board footprint and robust solder connections.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard embedded environments.
• Compliance — RoHS compliant.

Typical Applications

• Custom Digital Logic and Prototyping — Use the device’s 13,248 logic elements and 1,472 CLBs to implement and iterate custom digital functions and prototypes.
• On‑Board Data Handling — Approximately 0.369 Mbits of embedded RAM provides local buffering and data-path storage for signal processing or interface bridging.
• Peripheral and Interface Control — 372 I/O pins enable direct connectivity to sensors, memory, and external interfaces for flexible system integration.

Unique Advantages

• Substantial Logic Resources: 13,248 logic elements and 1,472 CLBs deliver capacity for mid-range digital designs without external ASICs.
• On‑Chip Memory: Nearly 0.369 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
• High I/O Count: 372 user I/O pins simplify board-level routing and reduce the need for additional interface chips.
• Compact BGA Package: 484-ball BGA (23 × 23) offers a dense package option for space-constrained PCBs.
• Commercial-Grade Specification: Specified 0 °C to 85 °C operation and RoHS compliance support standard commercial deployment and regulatory expectations.

Why Choose XC3S700A-5FGG484C?

The XC3S700A-5FGG484C positions itself as a capable Spartan-3A FPGA option for commercial embedded designs that require a balance of logic density, on-chip memory, and extensive I/O in a compact BGA package. Its combination of 13,248 logic elements, approximately 0.369 Mbits of embedded RAM, and 372 I/O pins provides designers with the resources to implement mid-complexity digital systems while maintaining a streamlined BOM.

This device is well suited to engineers and teams seeking a commercially graded FPGA platform with clear electrical and thermal specifications (1.14 V–1.26 V core supply, 0 °C–85 °C operating range) and RoHS compliance for standard production deployments.

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