XC3S700A-4FGG484C

The XC3S700A-4FGG484C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC featuring 13,248 logic elements and approximately 368,640 bits of embedded memory. It provides 372 user I/Os and an estimated 700,000-gate equivalent capacity in a 484-ball BGA (23 × 23) package.

Designed for surface-mount applications, this commercial-grade device operates from a core supply range of 1.14 V to 1.26 V and a junction operating range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic — 13,248 logic elements and 1,472 CLBs provide on-chip programmable logic resources for implementing custom digital functions.
• Embedded Memory — Approximately 0.37 Mbits of on-chip RAM (368,640 bits) for local buffering, state storage, and temporary data storage.
• I/O Capacity — 372 user I/O pins to support broad interfacing requirements with external devices and peripherals.
• Gate Equivalent — Approximately 700,000 gates to convey device scale for complex logic designs.
• Package & Mounting — 484-ball BBGA (23 × 23) supplier device package with surface-mount mounting for compact board-level integration.
• Power & Temperature — Core supply range 1.14 V to 1.26 V and commercial operating range from 0 °C to 85 °C to match common board-level power domains and environments.
• Regulatory — RoHS compliant.

Unique Advantages

• Substantial Logic Capacity: 13,248 logic elements and ~700,000-gate equivalent capacity enable implementation of sizable custom logic functions on a single device.
• Integrated Memory: Approximately 0.37 Mbits of embedded RAM reduces external memory dependency for many control and buffering tasks.
• High I/O Count: 372 I/Os facilitate extensive interfacing options without immediate need for I/O expanders.
• Compact BGA Packaging: 484-BBGA (23 × 23) package supports dense board layouts while providing the necessary ball count for power and signal routing.
• Commercial Temperature Rating: 0 °C to 85 °C operation aligns with many standard electronics applications.
• RoHS Compliance: Conforms to common lead-free manufacturing requirements.

Why Choose XC3S700A-4FGG484C?

The XC3S700A-4FGG484C combines a sizeable logic fabric, on-chip memory, and a large I/O complement in a compact 484-BBGA package—offering a balanced integration of capacity and board-level density. Its voltage and temperature specifications make it suitable for commercial designs that require programmable logic with embedded memory and substantial I/O connectivity.

This device is appropriate for development teams and procurement seeking a RoHS-compliant Spartan®-3A FPGA with clear electrical and mechanical specifications, providing predictable integration into surface-mount PCB assemblies.

Request a quote or submit a pricing inquiry for the XC3S700A-4FGG484C to check availability and lead times.