XC3S700A-4FGG400I

The XC3S700A-4FGG400I is a Spartan®-3A Field Programmable Gate Array (FPGA) from AMD supplied in a 400-ball FBGA (21×21) package. It delivers configurable logic capacity, on-chip RAM, and a high I/O count in a compact surface-mount package optimized for industrial-temperature applications.

With 13,248 logic elements, approximately 0.37 Mbits of embedded memory and 311 I/O, this device is suited to industrial embedded designs that require moderate logic density, plentiful I/O, and operation across a wide temperature range.

Key Features

• Core Logic 13,248 logic elements providing configurable resources for custom digital functions; approximately 700,000 equivalent gates.
• Embedded Memory Approximately 0.37 Mbits of on-chip RAM, enabling local buffering and state storage for control and data-path tasks.
• I/O Density 311 user I/O pins to support interfaces and peripheral connectivity without external expander devices.
• Power Core voltage supply range from 1.14 V to 1.26 V to match system power architectures.
• Package & Mounting 400-ball FBGA (21×21) package, surface-mount mounting for compact PCB integration and high pin density.
• Operating Range Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Industrial Control Implements custom logic for motor control, PLC interfaces, and real-time processing where industrial temperature range and reliable I/O count are required.
• Embedded Systems Provides glue logic, data-path processing, and peripheral aggregation in embedded platforms that benefit from on-chip RAM and flexible I/O.
• Interface Bridging Handles protocol conversion and I/O bridging tasks using available logic elements and 311 I/O lines to connect diverse subsystems.

Unique Advantages

• Moderate Logic Capacity: 13,248 logic elements allow implementation of meaningful custom digital functions without excessive device complexity.
• High I/O Count: 311 I/O pins reduce the need for additional interface components and simplify board-level routing for multi-peripheral designs.
• Compact, High-Density Package: 400-FBGA (21×21) keeps PCB footprint compact while maintaining extensive pin availability for complex designs.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C to support deployment in industrial and harsh-environment applications.
• On-Chip Memory: Approximately 0.37 Mbits of embedded RAM supports buffering and local data storage to improve system responsiveness.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC3S700A-4FGG400I?

The XC3S700A-4FGG400I balances logic capacity, embedded memory, and a high I/O count in a compact 400-FBGA package with industrial temperature capability. It is positioned for engineers and procurement teams seeking a configurable silicon solution for industrial embedded systems, interface-intensive designs, and applications that require reliable operation across a wide temperature range.

Its combination of 13,248 logic elements, roughly 0.37 Mbits of on-chip RAM, 311 I/O and a surface-mount 400-BGA package offers a practical trade-off of integration and board-level density for medium-complexity FPGA implementations.

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