XC3S700A-4FGG400C

The XC3S700A-4FGG400C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC from AMD, provided in a 400‑BGA (400‑FBGA, 21×21) package. It integrates 13,248 logic elements, 368,640 bits of on-chip RAM and 311 general-purpose I/O pins in a surface-mount package, offering a compact platform for programmable digital logic implementations.

Key Features

• Core Logic  13,248 logic elements and approximately 700,000 gates provide the programmable fabric for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.37 Mbits (368,640 bits) of total on-chip RAM for buffering, small FIFOs and local storage.
• I/O Density  311 available I/O pins allow flexible connectivity to peripherals, sensors and external interfaces.
• Package & Mounting  400‑BGA package (400‑FBGA, 21×21) with surface-mount mounting suited for compact board layouts.
• Power  Core voltage supply range of 1.14 V to 1.26 V, enabling defined power provisioning for the FPGA core.
• Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Logic and Prototyping  Leverage 13,248 logic elements and 311 I/Os to implement and validate custom digital designs and prototypes.
• Interface Bridging  Use the FPGA’s I/O resources to bridge or glue multiple digital interfaces on compact PCBs.
• On-board Data Handling  Embedded RAM (368,640 bits) supports local buffering and small data structures for embedded processing tasks.
• Compact System Integration  400‑BGA package and surface-mount mounting enable integration into space-constrained electronic assemblies.

Unique Advantages

• High Logic Capacity: 13,248 logic elements and ~700,000 gates provide substantial programmable resources for moderate-complexity designs.
• Balanced Memory and I/O: On-chip RAM (368,640 bits) combined with 311 I/Os supports local data handling and flexible external connectivity, reducing the need for some external components.
• Compact Packaging: The 400‑FBGA (21×21) package supports dense board layouts while keeping the device surface-mount compatible.
• Defined Power Envelope: A core supply range of 1.14 V to 1.26 V simplifies power rail design and component selection.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation for mainstream electronics and embedded product designs.
• RoHS Compliant: Conforms to RoHS environmental requirements for lead-free manufacturing processes.

Why Choose XC3S700A-4FGG400C?

The XC3S700A-4FGG400C delivers a balanced combination of logic density, embedded memory and I/O count within a compact 400‑BGA surface-mount package. It is well suited for designers who require substantial programmable resources and flexible board-level integration while operating within commercial temperature and voltage ranges.

Manufactured by AMD, this Spartan®-3A FPGA provides a clear specification set—logic elements, on-chip RAM, I/O count, package and supply requirements—helping engineering and procurement teams evaluate fit for projects that demand moderate gate counts and a compact footprint.

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