XC3S50AN-4FTG256C

The XC3S50AN-4FTG256C is a Spartan®-3AN Field Programmable Gate Array (FPGA) supplied in a 256-LBGA package. It delivers a compact, surface-mount programmable logic solution with mid-range capacity suitable for commercial embedded designs.

Key attributes include 176 CLBs (approximately 1,584 logic elements), about 55,296 bits of on-chip RAM, 195 I/O pins and RoHS compliance, making it appropriate for designs that need moderate logic density, on-chip memory and a significant number of external interfaces.

Key Features

• Core Logic 176 CLBs providing approximately 1,584 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory Approximately 55,296 bits of on-chip RAM to support small data buffers, FIFOs and state storage.
• I/O Capacity 195 general-purpose I/O pins to handle multiple external interfaces, sensor inputs and control signals.
• Package & Mounting 256-LBGA surface-mount package; supplier device package listed as 256-FTBGA (17×17) for compact board-level integration.
• Power Core supply operating range from 1.14 V to 1.26 V for predictable power budgeting in system designs.
• Operating Conditions Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.
• Logic Scale Rated at approximately 50,000 gates, suitable for low- to mid-density programmable logic requirements.

Typical Applications

• Embedded Systems — Implement control logic and custom processing functions that fit within 1,584 logic elements and local RAM.
• I/O Bridging & Interface Control — Manage multiple peripheral connections using the device's 195 I/O pins for protocol conversion and glue logic.
• Prototyping & Development — Use the Spartan-3AN FPGA for proof-of-concept boards and development where a compact 256-LBGA package is required.
• Mid-Density Digital Functions — Realize finite-state machines, small datapaths and control sequencers leveraging the on-chip RAM and CLB resources.

Unique Advantages

• Balanced Logic and Memory: Combines 176 CLBs and approximately 55,296 bits of embedded RAM to support a range of mid-density designs without external memory.
• High I/O Count: 195 I/O pins allow flexible connectivity to peripherals, sensors and interfaces, reducing the need for external I/O expanders.
• Compact, Surface-Mount Package: 256-LBGA / 256-FTBGA (17×17) packaging enables dense board layouts and simplifies assembly for space-constrained applications.
• Predictable Power Envelope: Narrow core voltage range (1.14 V–1.26 V) assists in accurate power supply design and thermal planning.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match standard commercial deployments and environments.
• RoHS Compliant: Meets RoHS requirements for environmental and regulatory conformity in commercial products.

Why Choose XC3S50AN-4FTG256C?

The XC3S50AN-4FTG256C offers a compact, commercial-grade FPGA solution that balances logic capacity, on-chip memory and I/O count for mid-range embedded and interface-centric designs. Its 256-LBGA footprint and surface-mount construction make it well suited for space-conscious PCBs where moderate programmable logic and multiple external connections are required.

This part is a practical choice for teams needing a programmable logic device with defined power and temperature characteristics, RoHS compliance, and a logic/memory profile that supports glue logic, control functions and modest datapath implementations while maintaining a compact board-level presence.

Request a quote or submit a pricing inquiry for XC3S50AN-4FTG256C to receive availability and lead-time information for your next design. Include the part number and quantity required when submitting your request.