XC3S50A-5FTG256C

The XC3S50A-5FTG256C is a Spartan®-3A Field Programmable Gate Array (FPGA) in a 256-LBGA package, delivering a compact, programmable logic solution for commercial-grade designs. It combines a mid-range logic capacity with on-chip memory and a broad I/O complement.

Key device attributes include 176 CLBs providing 1,584 logic elements, approximately 55,296 bits of embedded RAM, 144 I/O pins, a nominal core supply range of 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C—packaged as a surface-mount 256-FTBGA (17×17).

Key Features

• Core Logic 176 CLBs delivering 1,584 logic elements suitable for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.055 Mbits of on-chip RAM (55,296 bits) to support buffering, state machines, and small data structures.
• I/O Capacity 144 general-purpose I/O pins provide a wide interface capability for external peripherals and signals in a compact footprint.
• Gate Count Contains 50,000 gates to characterize overall device complexity and integration potential.
• Power Core voltage supply range of 1.14 V to 1.26 V for integration with low-voltage power architectures.
• Package & Mounting Surface-mount 256-LBGA package, supplier device package 256-FTBGA (17×17), optimized for space-constrained PCB designs.
• Operating Range & Compliance Commercial temperature grade (0 °C to 85 °C) and RoHS-compliant construction for standard manufacturing requirements.

Typical Applications

• Custom Digital Logic Prototyping — Use the device’s 1,584 logic elements and 176 CLBs to implement and validate bespoke digital functions and algorithms.
• I/O-Intensive Interface Control — With 144 I/O pins in a compact 256-LBGA, the device supports designs that require multiple external interfaces in limited board area.
• Embedded Memory-Dependent Functions — Approximately 55,296 bits of on-chip RAM enable small buffering and state management without external memory in many use cases.

Unique Advantages

• Compact, BGA Package: The 256-LBGA (256-FTBGA, 17×17) package delivers a high-density solution suitable for tight PCB layouts.
• Balanced Logic and Memory: 176 CLBs with 1,584 logic elements and 55,296 bits of RAM provide a balanced resource set for mid-range programmable tasks.
• Substantial I/O Count: 144 I/O pins allow flexible connectivity to peripherals, sensors, and external components without large package trade-offs.
• Low-Voltage Core: The 1.14 V to 1.26 V supply range aligns with modern low-voltage power domains used in many commercial designs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant construction to meet standard production requirements.

Why Choose XC3S50A-5FTG256C?

The XC3S50A-5FTG256C positions itself as a mid-range Spartan®-3A FPGA option that combines a clear balance of logic capacity, embedded RAM, and a sizable I/O count in a small 256-LBGA package. Its specifications suit commercial-grade designs that need programmable logic, modest on-chip memory, and broad interfacing capability within constrained board space.

This device is appropriate for engineering teams and procurement seeking a surface-mount FPGA with defined logic resources (1,584 logic elements), 144 I/O pins, a 1.14 V–1.26 V power envelope, and commercial temperature operation. The RoHS-compliant 256-FTBGA package supports standard manufacturing processes and compact system integration.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XC3S50A-5FTG256C.