XC3S50A-4TQG144I

The XC3S50A-4TQG144I is a Spartan®-3A Field Programmable Gate Array (FPGA) from AMD, supplied in a 144-lead LQFP surface-mount package. It delivers a compact, industrial-grade programmable logic platform with 1,584 logic elements, approximately 55.3kbits of embedded memory, and 108 general-purpose I/O for flexible interfacing.

This device is suited to applications requiring modest logic density, numerous I/O signals, and operation across a wide temperature range while operating from a low-voltage core supply of 1.14 V to 1.26 V.

Key Features

• Core & Logic 1,584 logic elements and an estimated 50,000 gates provide a programmable logic fabric for implementing custom digital functions.
• Embedded Memory Approximately 55,296 bits (≈0.055 Mbits) of on-chip RAM to support small FIFOs, buffers, and state-machine storage.
• I/O Count 108 I/O pins enable broad external connectivity for sensors, peripherals, and digital interfaces.
• Power Core supply range of 1.14 V to 1.26 V to match low-voltage system environments.
• Package & Mounting 144-LQFP package (supplier device package: 144-TQFP, 20×20 mm) in a surface-mount form factor for compact PCB layouts.
• Operating Conditions Industrial-grade operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant for regulatory adherence in assembly and distribution.
• Manufacturer Supplied by AMD, providing consistency with documented product support and specifications.

Typical Applications

• Interface and I/O Expansion Use the 108 I/O signals to implement parallel and serial interfacing, glue logic, and protocol bridging for embedded systems.
• Small-Scale Custom Logic Implement control logic, state machines, and custom accelerators within the device’s 1,584 logic elements and embedded RAM.
• Industrial Control Leverage the industrial temperature range and surface-mount 144-LQFP package for compact control modules and instrumentation.

Unique Advantages

• Compact, surface-mount package: 144-LQFP (20×20 mm) balances board space and routeability for space-constrained designs.
• Ample I/O: 108 I/O pins enable flexible external interfacing without adding external glue components.
• Balanced logic density: 1,584 logic elements and ~50,000 gates suit modest custom-logic implementations while keeping cost and power manageable.
• On-chip memory: Approximately 55.3kbits of embedded RAM supports buffering, small data stores, and finite-state logic.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in harsh environments.
• Low-voltage core operation: 1.14 V to 1.26 V core supply aligns with modern low-voltage system designs.
• RoHS compliant: Conforms to lead-free assembly requirements for global manufacturing.

Why Choose XC3S50A-4TQG144I?

The XC3S50A-4TQG144I is positioned for designers needing a compact, industrial-grade FPGA with a moderate logic capacity, substantial I/O, and embedded memory for control and interface tasks. Its 144-LQFP surface-mount package and low-voltage core make it suitable for integration into space-conscious, low-voltage systems that require reliable operation across a wide temperature range.

For teams implementing small to medium complexity digital designs, this device provides a practical balance of programmable resources, I/O flexibility, and industrial operating range backed by manufacturer documentation and RoHS compliance.

If you would like pricing or availability information, request a quote or submit an inquiry to receive a formal quote and lead-time details.