XC3S50A-4FTG256I

The XC3S50A-4FTG256I is a Spartan®-3A field programmable gate array (FPGA) IC from AMD, offered in a 256-pin low-profile BGA package. It provides mid-density programmable logic with a combination of logic elements, embedded memory, and a substantial I/O complement targeted at industrial and embedded applications.

Key on-chip resources include 1,584 logic elements, 55,296 bits of embedded RAM, and 144 user I/O pins, all delivered in a surface-mount 256-LBGA (256-FTBGA 17×17) package with an industrial operating temperature range.

Key Features

• Core Logic  Approximately 1,584 logic elements and about 50,000 gates provide mid-density programmable logic resources for implementing custom digital functions.
• Embedded Memory  55,296 bits of on-chip RAM enable local buffering, small FIFOs, and state storage for control and data-path logic.
• I/O Capability  144 user I/O pins support connectivity to external peripherals and interfaces while enabling flexible board-level integration.
• Package & Mounting  Supplied in a 256-LBGA package (256-FTBGA, 17×17) and designed for surface-mount assembly to support compact PCB layouts.
• Power  Core supply voltage range is specified from 1.14 V to 1.26 V, enabling predictable power design for the programmable core.
• Thermal & Environmental  Rated for industrial temperatures from −40 °C to 100 °C and RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Industrial Control  Use as a mid-density programmable logic device for motor control, PLC auxiliary logic, and industrial automation where an industrial temperature rating is required.
• Embedded System Glue Logic  Implement custom interface bridging, timing adaptation, and peripheral control leveraging 144 I/O pins and on-chip RAM for buffering.
• Communications and Protocol Handling  Offload or implement protocol-specific framing, serialization/deserialization, and custom packet handling using the FPGA’s logic and RAM resources.
• User Interface and Control  Drive custom front-end logic, keypad/LED control, and intermediate signal processing within compact, surface-mount designs.

Unique Advantages

• Mid-density Logic Integration: Approximately 1,584 logic elements and ~50,000 gates balance capability and board-area efficiency for many embedded designs.
• On-chip RAM for Local Data Handling: 55,296 bits of embedded memory reduce reliance on external RAM for small buffers and control-state storage.
• High I/O Count: 144 user I/O pins enable direct interfacing to multiple peripherals and sensors without immediate need for external I/O expanders.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in temperature-demanding environments.
• Compact Surface-Mount Package: The 256-LBGA (17×17) package supports dense PCB layouts while maintaining a robust physical form factor.
• RoHS Compliant: Conforms to RoHS requirements for environmental compliance in manufacturing and production.

Why Choose XC3S50A-4FTG256I?

The XC3S50A-4FTG256I provides a balanced, industrial-grade FPGA option for designs that require mid-level programmable logic, a substantive I/O count, and on-chip memory in a compact BGA package. Its specified core voltage range and wide operating temperature make it suitable for embedded and industrial applications where predictable electrical and thermal behavior matter.

This part is well suited to engineers and procurement teams seeking a surface-mount, RoHS-compliant Spartan®-3A device from AMD that combines integration and reliability for control, interfacing, and protocol tasks in production systems.

Request a quote or submit an inquiry to get pricing and lead-time information for the XC3S50A-4FTG256I.