XC3S50A-4FT256I

The XC3S50A-4FT256I is an industrial‑grade Spartan®-3A field programmable gate array (FPGA) from AMD supplied in a 256‑lead low‑profile BGA package. It integrates approximately 1,584 logic elements, roughly 55 kbits of on‑chip RAM, and support for up to 144 I/O pins, providing a compact programmable logic solution for space‑constrained embedded designs.

This device is specified for a 1.14 V to 1.26 V core supply and rated for operation from −40 °C to 100 °C, making it suitable for industrial environments that require reliable programmable logic with a small footprint.

Key Features

• Core Logic Approximately 1,584 logic elements and an estimated 50,000 gates provide the fundamental programmable resources for implementating custom digital functions.
• Embedded Memory Approximately 55 kbits (55,296 bits) of on‑chip RAM for small buffers, state machines, and local storage.
• I/O Capacity Up to 144 user I/O pins support interfacing with peripherals, sensors, and external logic in compact designs.
• Power Supply Core supply range from 1.14 V to 1.26 V enables use with tight voltage rails typical of modern programmable logic cores.
• Package & Mounting 256‑lead LBGA package (supplier package 256‑FTBGA, 17×17) in a surface‑mount form factor for high‑density PCB designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in industrial temperature environments.
• RoHS Compliant Environmentally compliant design consistent with RoHS requirements.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating and flexible I/O count for control logic, sequencing, and interface conversion in factory automation equipment.
• Embedded System Glue Logic — Implement custom bus bridging, protocol adaptation, and peripheral control in space‑constrained embedded boards using the 256‑LBGA package.
• Prototyping and Small‑Scale FPGA Designs — Leverage the available logic elements and on‑chip RAM for developing and validating digital functions before scaling designs.

Unique Advantages

• Compact, High‑Density Package: The 256‑lead LBGA (17×17) provides a small footprint for mounting significant programmable logic in constrained board areas.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C to meet the environmental needs of industrial applications.
• Balanced Resource Set: A combination of approximately 1,584 logic elements and ~55 kbits of embedded RAM supports a range of small to medium complexity functions without over‑provisioning.
• Generous I/O Count: 144 I/O pins enable multiple peripheral interfaces and flexible board partitioning for mixed‑signal and digital systems.
• Low‑Voltage Core: The specified 1.14 V to 1.26 V supply range aligns with modern low‑voltage FPGA core requirements for efficient power delivery.

Why Choose XC3S50A-4FT256I?

The XC3S50A-4FT256I positions itself as a compact, industrial‑grade FPGA option that combines a moderate logic capacity with useful on‑chip memory and a high I/O count in a 256‑LBGA package. Its temperature rating and RoHS compliance make it suitable for embedded systems that require reliable programmable logic in demanding environments.

This part is well suited to developers and procurement teams seeking a small‑footprint FPGA for industrial control, embedded interface logic, or prototyping where board space, operating temperature range, and balanced resources are key selection criteria.

If you would like pricing, availability, or to request a quote for the XC3S50A-4FT256I, please submit a request or quote inquiry and our team will respond with details.