XC3S500E-5PQ208C

The XC3S500E-5PQ208C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC from AMD. It integrates programmable logic resources, on-chip RAM and flexible I/O in a 208-pin BFQFP surface-mount package.

Targeted at commercial-grade designs, this device delivers 10,476 logic elements, approximately 0.37 Mbits of embedded memory and up to 158 I/O pins while operating over a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Core Logic  Spartan-3E architecture with approximately 10,476 logic elements and 1,164 configurable logic blocks (CLBs) for custom digital implementations.
• Capacity  Approximately 500,000 gates of logic density to support mid-range programmable designs.
• Embedded Memory  Total on-chip RAM of 368,640 bits (approximately 0.37 Mbits) for buffering, small FIFOs or state storage.
• I/O  Up to 158 user I/O pins to interface with peripherals, sensors and external logic.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package & Mounting  208-BFQFP (208-PQFP, 28 × 28) surface-mount package suitable for compact board-level integration.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Leverage the 10,476 logic elements and on-chip RAM to implement and iterate custom finite state machines, data paths and prototype systems.
• Interface and peripheral control  Use up to 158 I/O pins to bridge peripherals, handle bus interfaces and manage glue logic on compact PCBs.
• Data buffering and small memory functions  Embedded RAM (approximately 0.37 Mbits) supports short-term buffering, FIFOs and small lookup tables within the FPGA fabric.
• Compact, board-level systems  The 208-BFQFP surface-mount package offers a compact footprint for space-constrained commercial designs.

Unique Advantages

• Balanced logic capacity:  About 10,476 logic elements provide a mid-range programmable fabric suitable for diverse digital tasks without unnecessary overhead.
• Integrated memory:  Approximately 0.37 Mbits of on-chip RAM reduces external memory needs for control, buffering and small data tables.
• Ample I/O count:  158 user I/Os enable flexible interfacing with multiple peripherals, sensors and external logic devices.
• Compact packaging:  208-BFQFP surface-mount package facilitates dense board layouts while maintaining accessible pinout for I/O and power.
• Commercial operating range:  Rated for 0 °C to 85 °C operation to meet the requirements of standard commercial embedded systems.

Why Choose XC3S500E-5PQ208C?

The XC3S500E-5PQ208C positions itself as a commercially graded, mid-capacity Spartan-3E FPGA from AMD that combines a significant logic element count, embedded RAM and a high I/O count in a compact 208-pin BFQFP package. Its 1.14 V to 1.26 V supply range and commercial temperature rating make it suitable for a wide range of board-level programmable logic tasks.

This device is well suited for engineers and teams building compact, programmable systems that require on-chip memory, versatile I/O and a mid-range gate density—offering predictable integration and lifecycle fit for commercial embedded designs.

Request a quote or submit a pricing and availability inquiry for the XC3S500E-5PQ208C today to evaluate it for your next programmable logic design.