XC3S500E-5FTG256C

The XC3S500E-5FTG256C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 256-LBGA package. It delivers a mid-range balance of programmable logic, embedded memory and I/O density for commercial-grade applications.

Key on-chip resources include 1,164 CLBs, 10,476 logic elements, approximately 0.37 Mbits of embedded RAM and 190 I/O pins, making this device suitable for designs that require moderate logic capacity and compact surface-mount packaging.

Key Features

• Core and Logic  Spartan®-3E FPGA architecture with 1,164 CLBs and 10,476 logic elements, corresponding to an approximate 500,000-gate equivalent for programmable logic implementation.
• Embedded Memory  Approximately 0.37 Mbits (368,640 bits) of on-chip RAM to support buffering, small data storage and state-machine implementations.
• I/O and Capacity  190 user I/O pins to support multiple parallel interfaces and signal domains within a single device.
• Power and Supply  Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling predictable power budgeting for the core rail.
• Package and Mounting  256-LBGA package (supplier device package: 256-FTBGA, 17 × 17 mm) in a surface-mount form factor for compact board layouts.
• Operating Conditions and Compliance  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental regulatory alignment.

Unique Advantages

• Balanced logic density: The combination of 1,164 CLBs and 10,476 logic elements provides a mid-range logic resource suitable for compact digital designs.
• On-chip memory for local buffering: Approximately 0.37 Mbits of embedded RAM reduces the need for small external memory devices in many applications.
• High I/O count: 190 I/O pins support integration of multiple interfaces and parallel signals without external multiplexing.
• Compact, surface-mount packaging: 256-LBGA (17 × 17 mm) minimizes PCB footprint while keeping routing density manageable for SMT assembly.
• Predictable power rail: Narrow core supply range (1.14 V to 1.26 V) simplifies core power design and regulation selection.
• RoHS compliant and commercial grade: Meets RoHS requirements and is specified for 0 °C to 85 °C operation for commercial deployment.

Why Choose XC3S500E-5FTG256C?

The XC3S500E-5FTG256C positions itself as a commercially graded Spartan®-3E FPGA that combines a useful mix of logic elements, embedded RAM and I/O in a compact 256-LBGA surface-mount package. Its resource set and package profile suit designers who need a mid-range programmable device with predictable power and thermal characteristics.

This device offers a practical balance of integration and board-level simplicity, providing on-chip memory and substantial I/O capacity that can reduce external component count and simplify system design for commercial applications.

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