XC3S500E-5FGG320C

The XC3S500E-5FGG320C is a Spartan®-3E field programmable gate array (FPGA) IC from AMD. It provides reconfigurable digital logic with 10,476 logic elements and approximately 0.37 Mbits of on-chip RAM to implement custom digital functions.

This surface-mount FPGA is offered in a 320-ball BGA package and targets commercial-grade applications where mid-range gate density, substantial I/O count, and embedded memory are required.

Key Features

• Core Logic  Provides 10,476 logic elements to implement combinational and sequential digital logic functions.
• Embedded Memory  Approximately 0.37 Mbits of total on-chip RAM bits for data buffering, FIFOs, and small lookup tables.
• I/O Capacity  232 user I/O pins to support multiple external interfaces and parallel connections.
• Gate Density  Rated at 500,000 gates for mid-range integration of logic and control functions.
• Package & Mounting  320-ball BGA (supplier device package: 320-FBGA, 19×19) in a surface-mount form factor for compact PCB designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rails.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Custom Digital Systems  Implement application-specific logic where 10,476 logic elements and on-chip RAM enable tailored datapaths and control logic.
• I/O-Intensive Designs  Use the 232 available I/O pins to connect multiple peripherals, sensors, or parallel interfaces directly to the FPGA.
• Embedded Memory Tasks  Leverage approximately 0.37 Mbits of embedded RAM for buffering, temporary storage, and small lookup tables within control and signal-processing blocks.

Unique Advantages

• Balanced Logic and Memory:  Combines 10,476 logic elements with embedded RAM to support integrated digital designs without excessive external memory.
• High I/O Count:  232 user I/Os simplify board-level integration by supporting multiple interfaces and peripherals directly.
• Compact BGA Package:  320-ball BGA (19×19) enables a higher pin density in a compact footprint for space-constrained PCBs.
• Controlled Power Range:  Specified core voltage range (1.14 V–1.26 V) allows predictable power planning and supply design.
• Commercial Temperature Rating:  Rated 0 °C to 85 °C for applications within standard commercial operating environments.
• RoHS Compliant:  Meets RoHS requirements for environmentally conscious designs and supply-chain compliance.

Why Choose XC3S500E-5FGG320C?

The XC3S500E-5FGG320C positions itself as a mid-range Spartan®-3E FPGA option that blends substantial logic capacity, a meaningful amount of embedded RAM, and a high I/O count in a compact 320-BGA package. Its specifications suit commercial applications that require integrated digital logic with direct peripheral connectivity and predictable power and thermal characteristics.

This AMD FPGA is appropriate for designers who need reconfigurable logic with approximately 500k gates, 10,476 logic elements, and 232 I/Os—providing a cost-effective building block for control, interfacing, and custom digital functions while remaining RoHS compliant.

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