XC3S500E-4VQG100I
| Part Description |
Spartan®-3E Field Programmable Gate Array (FPGA) IC 66 368640 10476 100-TQFP |
|---|---|
| Quantity | 865 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 66 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1164 | Number of Logic Elements/Cells | 10476 | ||
| Number of Gates | 500000 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 368640 |
Overview of XC3S500E-4VQG100I – Spartan®-3E Field Programmable Gate Array (FPGA) IC 66 368640 10476 100-TQFP
The XC3S500E-4VQG100I is an AMD Spartan®-3E field programmable gate array supplied in a 100-pin TQFP package. It provides a measurable combination of programmable logic, on-chip RAM, and I/O capacity for industrial-grade embedded designs.
With 10,476 logic elements, approximately 0.369 Mbits of embedded memory, and 66 user I/O, this device targets applications that require mid-range logic density and reliable operation across a wide industrial temperature range.
Key Features
- Logic Capacity — 10,476 logic elements and 1164 CLB count provide programmable logic resources for implementing custom digital functions.
- Embedded Memory — 368,640 total RAM bits (approximately 0.369 Mbits) for on-chip data buffering, state storage, and small memory structures.
- I/O Resources — 66 user I/O pins suitable for interfacing with external peripherals and system signals.
- Gate Count — 500,000 gates to quantify device complexity and integration capability.
- Power Supply — Core voltage range of 1.14 V to 1.26 V for system power planning and regulator selection.
- Package & Mounting — Supplied in a 100-TQFP package (supplier device package listed as 100-VQFP, 14×14); surface-mount mounting type supports PCB assembly processes.
- Industrial Rating — Grade: Industrial with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
- Regulatory — RoHS compliant for environmental and manufacturing compliance.
Typical Applications
- Industrial Control & Automation — Industrial-grade temperature range and programmable logic allow implementation of custom control algorithms and machine interface logic.
- Embedded System Integration — Logic density and on-chip RAM support peripheral integration, glue-logic replacement, and protocol adaptation in embedded boards.
- Communications & Networking Modules — The combination of logic elements and I/O count enables customizable data path and interface functions in mid-range communications hardware.
- Test & Measurement Equipment — On-chip memory and programmable gates can be used for data capture, preprocessing, and instrument control functionality.
Unique Advantages
- Balanced Logic and Memory — 10,476 logic elements paired with 368,640 RAM bits supports a wide range of mid-density designs without external memory for small buffers.
- Industrial Temperature Capability — Rated from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
- Defined Power Envelope — Narrow core voltage range (1.14 V–1.26 V) simplifies power supply design and regulator selection.
- Compact Surface-Mount Package — 100-pin TQFP/VQFP packaging enables compact PCB layouts while providing ample I/O.
- RoHS Compliant — Conforms to RoHS requirements for environmentally conscious manufacturing.
Why Choose XC3S500E-4VQG100I?
The XC3S500E-4VQG100I positions itself as a practical, industrial-grade FPGA option for designs that need mid-range programmable logic, modest on-chip memory, and a defined set of I/O in a compact surface-mount package. Its specifications make it suitable for embedded systems, industrial control, and instrumentation where operating temperature and RoHS compliance are required.
Engineers and procurement teams selecting this part will benefit from clear, verifiable device parameters—logic capacity, RAM bits, I/O count, gate count, package type, and operating conditions—to evaluate fit against system requirements and PCB constraints.
Request a quote or submit a pricing inquiry for the XC3S500E-4VQG100I to begin procurement or receive availability details.

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