XC3S500E-4PQG208I

The XC3S500E-4PQG208I is a Spartan®-3E Field Programmable Gate Array (FPGA) from AMD designed for industrial-grade embedded logic applications. It integrates 10,476 logic elements, on-chip memory, and a broad I/O complement to address control, interface and system integration tasks where temperature range and package density matter.

Key Features

• Core Logic — 10,476 logic elements providing the programmable logic resources required for custom digital functions; approximately 500,000 equivalent gates are available for complex designs.
• Embedded Memory — Approximately 0.369 Mbits of on-chip RAM (368,640 bits) for FIFOs, buffers, state machines and other data storage needs.
• I/O Capacity — 158 user I/O pins to support multiple peripheral interfaces and system-level connectivity without excessive external glue logic.
• Power — Core supply range of 1.14 V to 1.26 V to match system power rails and support predictable power budgeting.
• Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB space efficiency.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Manufacturer — AMD Spartan®-3E family device with established silicon lineage.

Typical Applications

• Industrial Control — Implement motor control logic, sensor interfacing and intermediary control functions that benefit from industrial temperature tolerance and robust I/O counts.
• Embedded System Integration — Consolidate glue logic, bus bridging and custom peripheral control using the device’s logic resources and on-chip RAM.
• I/O Expansion and Interface — Provide parallel/serial interface aggregation and protocol adaptation leveraging 158 available I/O pins.
• Prototyping and Low-to-Medium Volume Products — Use the programmable fabric to iterate digital designs and validate system functions before production.

Unique Advantages

• High Logic Density: 10,476 logic elements enable integration of multiple functions into a single device, reducing component count and board complexity.
• On-Chip Memory Resources: Approximately 0.369 Mbits of embedded RAM supports local buffering and state machine implementations without external memory.
• Extensive I/O: 158 I/O pins give designers flexibility to connect sensors, actuators and peripherals directly to the FPGA fabric.
• Industrial-Grade Operation: Rated from −40 °C to 100 °C for deployment in harsher operating environments.
• Compact Surface-Mount Package: 208-BFQFP (28×28 PQFP) balances pin count and PCB footprint for dense boards.
• Defined Core Voltage Range: 1.14 V to 1.26 V supply range helps ensure consistent power integration in target systems.

Why Choose XC3S500E-4PQG208I?

The XC3S500E-4PQG208I positions itself as a practical, industrial-grade FPGA choice when mid-range logic capacity, meaningful on-chip memory and broad I/O are needed in a compact surface-mount package. Its combination of 10,476 logic elements, approximately 0.369 Mbits of embedded RAM and 158 I/O pins supports consolidation of control, interface and custom logic functions while simplifying board-level design.

Designed for customers building industrial and embedded systems, this AMD Spartan®-3E device offers a balanced mix of integration, predictable power requirements and an extended operating temperature range—delivering long-term value for designs that require reliable programmable logic in demanding environments.

Request a quote or submit a procurement inquiry to check pricing and availability for the XC3S500E-4PQG208I. Our team can provide lead-time and ordering details to support your design and production schedule.