XC3S500E-4PQG208C

The XC3S500E-4PQG208C is a Spartan®-3E field programmable gate array (FPGA) from AMD, offered in a 208‑BFQFP surface-mount package. It delivers a balance of on-chip logic, embedded memory, and I/O capacity suitable for commercial embedded and digital designs.

This device integrates configurable logic resources, approximately 0.369 Mbits of embedded memory and 158 I/O pins, enabling custom digital functions, buffering and interface logic within a compact 208‑pin package.

Key Features

• Core logic — 1,164 configurable logic blocks (CLBs) providing 10,476 logic elements for building custom digital circuits and state machines.
• Embedded memory — Approximately 0.369 Mbits of on-chip RAM for data buffering, LUT-based storage and small FIFOs.
• I/O capacity — 158 general-purpose I/O pins to support multiple interfaces and parallel connections.
• Device density — Equivalent to 500,000 gates for complex glue logic and medium-scale integration tasks.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and ensure predictable power domain design.
• Package and mounting — 208‑BFQFP (supplier package: 208‑PQFP, 28×28 mm footprint) in a surface-mount form factor for PCB assembly.
• Operating range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting environmental and assembly requirements.

Typical Applications

• Custom digital logic and prototyping — Implement state machines, protocol converters and glue logic using the device’s 10,476 logic elements and CLBs.
• Interface bridging and I/O expansion — Use the 158 I/O pins to connect multiple peripherals, parallel buses or external interfaces.
• On-chip buffering and small data stores — Leverage approximately 0.369 Mbits of embedded RAM for FIFOs, frame buffers or temporary data retention.

Unique Advantages

• Balanced integration: Combines CLBs, on-chip RAM and substantial I/O in a single 208‑pin package to reduce external component count.
• Compact package option: 208‑BFQFP surface-mount package (28×28 mm supplier PQFP footprint) simplifies PCB layout for space-constrained boards.
• Predictable power domain: Narrow core supply range (1.14–1.26 V) aids power supply design and stability for the FPGA core.
• Commercial grade suitability: Rated for 0 °C to 85 °C operations, matching many consumer and industrial-adjacent electronic applications.
• RoHS compliant: Meets common environmental and manufacturing requirements for modern electronics production.

Why Choose XC3S500E-4PQG208C?

The XC3S500E-4PQG208C positions itself as a versatile, medium-density Spartan®-3E FPGA that brings together a sizable pool of logic elements, embedded memory and flexible I/O in a compact 208‑pin BFQFP package. Its combination of resources makes it well suited to designers needing custom digital functions, moderate on-chip buffering and multiple external interfaces without large board-level complexity.

This commercial-grade device offers designers predictable power requirements and RoHS compliance, supporting reliable production and system integration within its specified operating temperature and voltage ranges.

Request a quote or submit a sales inquiry to obtain pricing, availability and lead-time information for the XC3S500E-4PQG208C.