XC3S50A-4FT256C

The XC3S50A-4FT256C is an AMD Spartan‑3A field programmable gate array supplied in a 256‑pin LBGA package. It provides configurable digital logic resources, on‑chip memory, and a substantial I/O count for compact, commercial‑grade designs.

With 1,584 logic elements and approximately 55.3 kbits of embedded memory, this device is targeted at applications that require moderate programmable logic capacity, flexible I/O, and a compact surface‑mount package.

Key Features

• Core Logic  176 configurable logic blocks (CLBs) delivering 1,584 logic elements for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 55.3 kbits (55,296 bits) of on‑chip RAM to support small FIFOs, register files, and buffering needs.
• I/O Connectivity  144 user I/O pins provide broad connectivity options for interfacing with external peripherals and buses.
• Device Scale  Approximately 50,000 gates of logic capacity for mid‑range programmable logic integration.
• Power  Specified supply voltage range of 1.14 V to 1.26 V for the core supply, enabling defined power budgeting in system design.
• Package and Mounting  Surface‑mount 256‑LBGA package (supplier package: 256‑FTBGA, 17 × 17 mm) for high‑density board assembly.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C to match typical commercial electronics environments.
• Compliance  RoHS‑compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• Embedded Logic and Glue‑Logic  Use the XC3S50A-4FT256C to implement custom control, protocol translation, or glue logic where 1,584 logic elements and 144 I/O pins meet integration needs.
• Peripheral and Interface Bridging  Leverage the device’s I/O density to bridge disparate interfaces and manage signal routing between subsystems.
• Prototyping and Development  Suitable for development platforms that require reprogrammable logic capacity and on‑chip RAM for temporary storage and testing.
• Instrumentation and Test  Deploy in test fixtures and measurement equipment that require configurable logic, moderate memory, and a compact LBGA footprint.

Unique Advantages

• Balanced Logic and Memory:  1,584 logic elements paired with approximately 55.3 kbits of on‑chip RAM provide a compact but capable resource mix for many commercial designs.
• High I/O Count in a Small Package:  144 I/O pins in a 256‑LBGA (17 × 17 mm supplier package) enable dense board implementations without sacrificing connectivity.
• Defined Low‑Voltage Core:  A specified core supply range of 1.14 V to 1.26 V supports predictable power design and voltage budgeting.
• Surface‑Mount, RoHS‑Compliant Package:  Surface‑mount LBGA packaging with RoHS compliance aligns with modern assembly processes and environmental requirements.
• Commercial Temperature Rating:  Operating over 0 °C to 85 °C suits a wide range of commercial electronics and end‑product environments.

Why Choose XC3S50A-4FT256C?

The XC3S50A-4FT256C positions itself as a compact, commercial‑grade FPGA option combining a useful balance of logic elements, embedded RAM, and a sizable I/O count in a small LBGA footprint. Its supply voltage window and RoHS compliance make it straightforward to integrate into contemporary, cost‑sensitive product designs.

This device is well suited for engineers and procurement teams designing mid‑range programmable logic solutions where board space, connectivity, and predictable operating conditions are primary considerations. The Spartan‑3A family heritage provides a familiar architecture and clear, verifiable hardware characteristics for system planning and long‑term design stability.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3S50A-4FT256C. Our team can provide lead‑time details and support for your procurement needs.