XC3S50A-4TQ144C

The XC3S50A-4TQ144C is a Spartan®-3A field programmable gate array (FPGA) IC from AMD, supplied in a 144-pin LQFP package. It delivers moderate logic density and on-chip memory in a compact, surface-mount package targeted at commercial-grade FPGA applications.

With 1,584 logic elements, 55,296 bits of total on-chip RAM, and 108 user I/O pins, the device is suited to designs that require a balance of configurable logic, embedded memory, and I/O capacity while operating at a low core voltage range.

Key Features

• Core Logic Capacity  Provides 176 CLBs and 1,584 logic elements for implementing custom logic and control functions; total gate count is specified at 50,000 gates.
• On-Chip Memory  Contains 55,296 bits of total RAM, enabling localized buffering, small data storage, and state machine implementations without external memory.
• I/O and Interfaces  Offers 108 user I/O pins to support a variety of external peripherals and signal connections in a single-package solution.
• Package & Mounting  Supplied in a 144-LQFP (supplier device package: 144-TQFP 20×20) for surface-mount PCB assembly and compact board layouts.
• Power  Core voltage supply range is 1.14 V to 1.26 V, suitable for low-voltage FPGA implementations.
• Temperature & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Custom Logic and Glue  Implement glue logic, protocol bridging, and custom finite-state machines using the device's 1,584 logic elements and 50,000-gate capacity.
• On-Board Memory Buffering  Leverage 55,296 bits of embedded RAM for small buffering tasks, buffering sensor data, or temporary storage in data paths.
• High I/O Integration  Use the 108 I/O pins to integrate multiple peripherals and external interfaces within a single FPGA package.

Unique Advantages

• Balanced Logic and Memory:  Combines 1,584 logic elements with 55,296 bits of RAM to support moderate-complexity designs without external memory for many use cases.
• Compact, Manufacturable Package:  144-LQFP (144-TQFP 20×20) surface-mount package simplifies PCB layout and supports standard assembly processes.
• Low-Voltage Core:  1.14 V to 1.26 V supply range reduces power domain complexity for low-voltage system architectures.
• Generous I/O Count:  108 user I/O pins enable integration of multiple sensors, interfaces, and peripherals on a single device.
• Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation and RoHS compliant for typical commercial manufacturing workflows.

Why Choose XC3S50A-4TQ144C?

The XC3S50A-4TQ144C positions itself as a commercial-grade, low-voltage FPGA option offering a practical mix of logic resources, embedded RAM, and I/O in a compact 144-LQFP package. Its specification set—1,584 logic elements, 55,296 bits of on-chip RAM, 108 I/O pins, and a 50,000-gate equivalent capacity—makes it suitable for designers needing moderate programmable logic and local memory without a large package footprint.

This device is appropriate for engineering teams and procurement focused on commercial applications that require a RoHS-compliant, surface-mount FPGA with defined operating temperature and core voltage ranges. Its combination of features supports streamlined designs where space, I/O count, and on-chip memory are key considerations.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S50A-4TQ144C.