XC3S50-4TQG144C

The XC3S50-4TQG144C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD, offering a compact, commercial-grade FPGA option with moderate logic density and on-chip memory. It combines 1728 logic elements across 192 CLBs, approximately 73,728 bits of embedded RAM, and 97 user I/Os in a 144-LQFP surface-mount package.

This device is positioned for commercial designs that require flexible digital logic, on-chip buffering, and a small-footprint package while maintaining RoHS compliance and a core voltage range of 1.14 V to 1.26 V.

Key Features

• Core Logic 1728 logic elements organized across 192 CLBs, providing up to 50,000 gates for implementing custom digital logic.
• Embedded Memory Approximately 0.074 Mbits of on-chip RAM (73,728 bits) for data buffering, state storage, and small working datasets.
• I/O 97 user I/O pins to support peripheral interfaces, signaling, and board-level connectivity.
• Power Core voltage supply range of 1.14 V to 1.26 V to match standard low-voltage FPGA power domains.
• Package & Mounting 144-LQFP package (supplier device package: 144-TQFP, 20×20) in a surface-mount form factor for compact PCB layouts.
• Operating Range & Grade Commercial-grade device rated for operation from 0°C to 85°C.
• Regulatory Compliance RoHS compliant for environmental and manufacturing standards.

Typical Applications

• Prototyping and Evaluation — Well suited to development boards and proof-of-concept designs where moderate logic and embedded memory are required.
• Embedded Control and Glue Logic — Implement peripheral coordination, interface bridging, and custom control logic using the device's I/O and CLB resources.
• Custom Digital Processing — Handle low-to-medium complexity signal processing, finite state machines, and timing-critical logic with on-chip RAM for temporary storage.
• Commercial Electronics — Compact package and surface-mount mounting make it appropriate for commercial consumer and industrial-adjacent products within the 0°C–85°C range.

Unique Advantages

• Moderate logic density in a compact footprint: 1728 logic elements and a 144-LQFP package reduce board area while supporting meaningful custom logic implementations.
• On-chip RAM lowers external BOM: 73,728 bits of embedded memory reduce the need for external RAM in many buffering and state-storage use cases.
• Generous I/O count: 97 user I/Os provide flexible connectivity for peripherals, sensors, and other board-level interfaces.
• Low-voltage core operation: 1.14 V to 1.26 V core supply aligns with common FPGA power domains for efficient integration.
• RoHS compliant and commercial grade: Meets RoHS requirements and is specified for operation across a commercial temperature range of 0°C to 85°C.
• Surface-mount 144-LQFP packaging: Facilitates automated assembly and dense PCB layouts in space-constrained designs.

Why Choose XC3S50-4TQG144C?

The XC3S50-4TQG144C delivers a balanced combination of logic resources, embedded memory, and I/O in a compact 144-LQFP package from AMD. Its specification set—1728 logic elements, approximately 73,728 bits of on-chip RAM, 97 I/Os, and a low-voltage core—makes it a practical choice for commercial designs that need flexible digital logic without large area or power overhead.

This FPGA suits designers and procurement teams targeting cost-sensitive commercial applications, rapid prototyping, and compact embedded systems. RoHS compliance and a defined commercial temperature range help ensure predictable integration into mainstream product lines.

Request a quote or submit a purchase inquiry for the XC3S50-4TQG144C to receive pricing and availability information tailored to your project needs.