XC3S400AN-4FTG256I

The XC3S400AN-4FTG256I is a Spartan®-3AN Field Programmable Gate Array (FPGA) IC from AMD. It provides 8,064 logic elements and a gate density of 400,000 gates in a compact 256-LBGA package.

Designed for industrial-grade applications, the device offers approximately 0.369 Mbits of embedded RAM, 195 I/O pins, a surface-mount 256-FTBGA (17×17) package, and an operating temperature range of –40 °C to 100 °C with a core supply range of 1.14 V to 1.26 V.

Key Features

• Core Logic  8,064 logic elements supporting complex, custom digital designs with a total gate count of 400,000.
• Embedded Memory  Approximately 0.369 Mbits of on-chip RAM suitable for buffering, state storage, and small tables.
• I/O Capacity  195 user I/O pins provide broad connectivity for parallel interfaces and external peripherals.
• Power  Core operating voltage range of 1.14 V to 1.26 V, allowing precise supply planning for system power domains.
• Package & Mounting  256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade  Industrial-grade device rated for operation from –40 °C to 100 °C, suitable for demanding environments.
• Compliance  RoHS-compliant manufacturing supports regulatory and environmental requirements.

Typical Applications

• Industrial Control  Industrial-grade temperature range and extensive I/O make this FPGA suitable for control and automation systems.
• Embedded Systems  On-chip memory and logic resources enable implementation of custom interfaces and embedded processing tasks.
• Digital Signal Processing  Gate density and abundant logic elements support moderate-scale signal processing and timing-critical logic.
• Custom Logic & Prototyping  Programmability and a compact BGA package allow integration of tailored digital functions into product prototypes and final designs.

Unique Advantages

• High Logic Capacity:  8,064 logic elements and 400,000 gates provide ample resources for complex digital designs without external logic.
• Integrated On-Chip RAM:  Approximately 0.369 Mbits of embedded memory reduces the need for small external memory devices for buffering and lookup tables.
• Extensive I/O Count:  195 I/O pins give designers flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Industrial Temperature Rating:  Rated for –40 °C to 100 °C operation, enabling reliable deployment in industrial and harsh-environment systems.
• Compact Surface-Mount Package:  256-LBGA (256-FTBGA, 17×17) offers a small footprint for space-constrained PCBs while supporting robust board-level mounting.
• RoHS Compliant:  Environmentally compliant manufacturing supports regulatory needs for commercial and industrial products.

Why Choose XC3S400AN-4FTG256I?

The XC3S400AN-4FTG256I positions itself as a versatile, industrial-grade Spartan®-3AN FPGA offering a balanced mix of logic density, on-chip memory, and I/O capacity in a compact BGA package. Its operating range and RoHS compliance make it suitable for designs that require reliability across temperature extremes and regulatory alignment.

This device is appropriate for engineers developing industrial control systems, embedded platforms, or custom digital logic where mid-range programmable capacity, significant I/O, and surface-mount packaging are key selection criteria. Its defined voltage and thermal specifications support clear power and thermal planning during system design.

If you would like pricing or availability, request a quote or submit an RFQ to receive a formal quotation and procurement details.