XC3S400AN-4FGG400C

The XC3S400AN-4FGG400C is a Spartan®-3AN field programmable gate array (FPGA) IC from AMD. It combines programmable logic resources, on-chip RAM, and a high I/O count in a compact 400‑ball BGA package to support a range of commercial embedded digital designs.

Key on-chip resources include 8,064 logic elements and approximately 0.369 Mbits of embedded RAM, with a supply voltage window of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 8,064 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.369 Mbits (368,640 bits) of on-chip RAM for data buffering, lookup tables, and small packet storage.
• I/O Density 311 user I/O pins enable connectivity to multiple peripherals, buses, and external interfaces.
• Gate Count 400,000 gates of equivalent logic capacity for mid-range integration tasks.
• Package and Mounting 400‑FBGA (21×21) package in a surface-mount format for compact board integration and high pin density.
• Power Nominal core supply range of 1.14 V to 1.26 V to match targeted power domains.
• Temperature & Grade Commercial grade with an operating temperature of 0 °C to 85 °C for standard commercial environments.
• Compliance RoHS compliant.

Typical Applications

• Custom Logic & Prototyping Implement and iterate custom digital logic and control functions using the FPGA’s logic elements and embedded RAM.
• Embedded System Glue Logic Use the device’s 311 I/Os to interface and bridge multiple peripherals, buses, or custom interfaces on a compact PCB footprint.
• Data Buffering and Small-Scale Processing Leverage approximately 0.369 Mbits of on-chip RAM for buffering, table lookups, and temporary storage in real-time data paths.

Unique Advantages

• Balanced Logic and Memory: 8,064 logic elements paired with ~0.369 Mbits of RAM provide a balanced resource mix for mid-range programmable designs.
• High I/O Count in a Compact Package: 311 I/Os delivered in a 400‑FBGA (21×21) package allow dense connectivity without a large board footprint.
• Clear Power Envelope: A specified supply range of 1.14 V to 1.26 V supports predictable power-domain planning.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match standard commercial product requirements.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious design and manufacturing.

Why Choose XC3S400AN-4FGG400C?

The XC3S400AN-4FGG400C positions itself as a commercial-grade, mid-range FPGA option that balances programmable logic capacity, embedded memory, and a high I/O count in a compact 400‑BGA package. Its specified voltage and temperature ranges make it suitable for a variety of standard commercial embedded designs that require programmable integration and moderate on-chip resources.

Manufactured by AMD, this device is appropriate for designers seeking a cost-effective, surface-mount FPGA solution with defined logic, RAM, and I/O characteristics for rapid development and deployment.

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