XC3S400AN-4FG400C

The XC3S400AN-4FG400C is a Spartan®-3AN field programmable gate array (FPGA) IC from AMD, offered in a 400‑ball BGA package. It combines a mid-range logic capacity with embedded memory and a high I/O count to address commercial embedded designs that require moderate logic resources and dense connectivity.

With 8,064 logic elements, approximately 0.369 Mbits of on‑chip RAM and 311 user I/Os, this device is suited to commercial applications that need a balance of integration and board-space efficiency while operating within a 1.14 V to 1.26 V core supply and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — Provides 8,064 logic elements to implement combinational and sequential logic for control, glue logic, and moderate-scale processing.
• Embedded Memory — Approximately 0.369 Mbits of on‑chip RAM for FIFOs, buffers, and small local data storage without external memory.
• I/O Density — 311 user I/Os to support multiple parallel interfaces, sensor connections, or bus implementations on a single device.
• Gate Count — Approximately 400,000 gates for feature-rich designs within a compact FPGA footprint.
• Power — Core voltage specified from 1.14 V to 1.26 V for predictable power domain design and board-level supply planning.
• Package & Mounting — 400‑BGA (supplier package 400‑FBGA, 21×21) surface-mount package for high pin density and compact PCB layouts.
• Operating Conditions & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for general-purpose applications.
• Environmental Compliance — RoHS compliant to meet common lead-free manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — Use the device where ~8,064 logic elements and 311 I/Os are required for control logic, protocol translation, or peripheral aggregation.
• Prototyping and Evaluation — Compact 400‑BGA package and substantial internal memory make this FPGA suitable for proof-of-concept designs and feature validation.
• Interface Aggregation — High I/O count enables consolidation of multiple digital interfaces and buses onto a single programmable device.

Unique Advantages

• Balanced Integration: Combines 8,064 logic elements with on‑chip RAM and 311 I/Os to reduce the need for external glue logic and discrete buffers.
• Compact, High‑Density Packaging: 400‑BGA (21×21) delivers numerous signals in a small PCB area for space-constrained designs.
• Predictable Power Envelope: Defined core voltage range (1.14 V to 1.26 V) aids in planning power supplies and thermal budgets.
• Commercial Temperature Support: Rated for 0 °C to 85 °C to match mainstream commercial environment requirements.
• Regulatory Compliance: RoHS compliant to align with lead‑free manufacturing and environmental restrictions.

Why Choose XC3S400AN-4FG400C?

The XC3S400AN-4FG400C is positioned for designers who need a commercially graded FPGA offering a practical balance of logic elements, embedded memory and a high I/O count in a compact 400‑BGA package. Its specifications support a broad range of general-purpose embedded and interface-centric designs while simplifying board layout and component count.

For projects that require approximately 8k logic elements, around 0.369 Mbits of on‑chip RAM, and up to 311 I/Os within a surface‑mount 400‑ball package, this Spartan®-3AN device provides a concise, RoHS‑compliant option suitable for commercial deployments.

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