XC3S400AN-4FG400I

The XC3S400AN-4FG400I is a Spartan®-3AN Field Programmable Gate Array designed for programmable logic integration. It combines a mid-range logic array with on-chip memory and a high I/O count in a compact 400-BGA package, suitable for industrial applications requiring configurable digital logic.

Key Features

• Core Logic — 896 configurable logic blocks (CLBs) providing 8,064 logic elements for implementing custom digital functions.
• Embedded Memory — Approximately 0.37 Mbits of on-chip RAM (368,640 total RAM bits) for local buffering and state storage.
• I/O and Gate Count — 311 general-purpose I/O pins and an approximate gate count of 400,000 to support complex interfacing and integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Package — 400-ball BGA package (400-FBGA, 21×21) optimized for surface-mount assembly.
• Temperature Range — Industrial operating temperature from -40°C to 100°C for deployment in demanding environments.
• Compliance & Mounting — RoHS compliant and available in a surface-mount package for standard PCB assembly processes.

Typical Applications

• Industrial Control — Use the industrial temperature rating and programmable logic capacity to implement custom control, sequencing, and I/O aggregation in automation equipment.
• Embedded Systems — Leverage 8,064 logic elements and on-chip RAM to prototype or deploy custom digital subsystems in embedded products.
• Communication Interfaces — Employ the 311 I/O pins and gate density to implement custom interface logic and multi-channel connectivity.

Unique Advantages

• High Logic Integration: 8,064 logic elements and 896 CLBs enable substantial custom logic implementation without external glue logic.
• Ample On-Chip Memory: Approximately 0.37 Mbits of embedded RAM supports buffering, FIFOs, and local data storage to simplify system architecture.
• Extensive I/O Count: 311 I/Os provide flexibility for complex peripheral and sensor interfacing without additional I/O expanders.
• Industrial Temperature Capability: Rated from -40°C to 100°C for reliable operation in a wide range of field environments.
• Compact BGA Packaging: 400-ball FBGA (21×21) offers a dense footprint for space-constrained board designs while supporting surface-mount assembly.
• Low-Voltage Core: Narrow core voltage range (1.14 V–1.26 V) simplifies power rail design for the FPGA core.

Why Choose XC3S400AN-4FG400I?

The XC3S400AN-4FG400I delivers a balanced combination of logic capacity, on-chip memory, and high I/O count in a compact 400-BGA package, making it suitable for industrial and embedded designs that require configurable digital logic and robust operating range. Its industrial temperature rating and RoHS compliance support deployment in demanding environments where reliability and regulatory compliance matter.

Designers and engineers seeking a mid-range programmable solution will find the XC3S400AN-4FG400I useful for consolidating custom logic, interfacing multiple peripherals, and reducing external component count while maintaining a compact PCB footprint.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S400AN-4FG400I and to discuss how it can fit into your next design.