XC3S400A-4FT256I

The XC3S400A-4FT256I is a Spartan®-3A field programmable gate array (FPGA) IC from AMD featuring 8,064 logic elements and approximately 0.369 Mbits of embedded RAM (368,640 bits). It provides 195 I/O pins and a programmable fabric capacity of 400,000 gates for custom digital logic implementations.

Packaged in a 256-LBGA surface-mount form (supplier package 256-FTBGA, 17×17) and rated for industrial operation from −40°C to 100°C with a core supply range of 1.14 V to 1.26 V, this device is targeted at applications that require defined logic density, substantial I/O, and compact board integration.

Key Features

• Core Logic 8,064 logic elements delivering a programmable fabric equivalent to 400,000 gates for implementing custom digital functions.
• Embedded Memory Approximately 0.369 Mbits of on-chip RAM (368,640 bits) for buffering, FIFOs, and local data storage.
• I/O Density 195 I/O pins to support multiple external interfaces and peripheral connections without excessive external glue logic.
• Power Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system designs.
• Package & Mounting 256-LBGA (supplier: 256-FTBGA, 17×17) in a surface-mount form factor for space-efficient PCB layouts.
• Temperature & Grade Industrial-grade device rated for operation from −40°C to 100°C for temperature-challenging environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom digital logic Implement state machines, protocol bridges, and real-time logic using the device's 8,064 logic elements and on-chip RAM.
• Peripheral interfacing and I/O consolidation Use the 195 I/Os to aggregate and manage multiple sensors, actuators, and interfaces on compact PCBs.
• Industrial control Deploy in systems requiring industrial-grade components and operation across −40°C to 100°C.

Unique Advantages

• Balanced programmable resource set: A combination of 8,064 logic elements and 400,000 gates for medium-complexity FPGA designs.
• On-chip RAM reduces external BOM: Approximately 0.369 Mbits of embedded memory minimizes reliance on external memory for many buffering tasks.
• High I/O count: 195 I/Os simplify integration with peripherals and reduce the need for external expanders.
• Industrial temperature rating: −40°C to 100°C operation supports deployment in demanding thermal environments.
• Compact surface-mount package: 256-LBGA (256-FTBGA, 17×17) enables dense PCB layouts and space savings.
• Low-voltage core operation: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage system architectures.

Why Choose XC3S400A-4FT256I?

The XC3S400A-4FT256I delivers a defined mix of logic capacity, embedded memory, and I/O density in a compact 256-LBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it appropriate for designs that require reliable operation across a broad thermal range and adherence to environmental standards.

This device is appropriate for engineering teams and procurement professionals specifying a field-programmable solution with roughly 8,064 logic elements, significant I/O capability, and on-chip RAM for buffering and local storage.

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