XC3S400A-4FGG320I

The XC3S400A-4FGG320I is a Spartan®-3A Field Programmable Gate Array (FPGA) optimized for industrial embedded designs. It provides a balance of programmable logic, on-chip RAM, and high I/O count in a compact 320-ball BGA package for space-constrained PCBs.

With 8,064 logic elements, approximately 0.37 Mbits of embedded memory and 251 user I/O, this device is suited to applications requiring medium-density logic integration, flexible interfacing and reliable operation across an industrial temperature range.

Key Features

• Logic Resources  8,064 logic elements available for implementing custom digital functions, control logic and finite-state machines.
• Embedded Memory  Approximately 0.37 Mbits of on-chip RAM (368,640 total RAM bits) for buffering, small data storage and state retention.
• I/O Capacity  251 user I/O pins to support multiple peripherals, buses and external interfaces without excessive external glue logic.
• Gate Equivalent  Equivalent to 400,000 gates, enabling moderately complex designs and integration of multiple functions on a single device.
• Package & Mounting  320-ball BGA (320-FBGA, 19×19) surface-mount package for high pin density in a compact footprint.
• Power  Core supply range of 1.14 V to 1.26 V to match low-voltage system domains.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsher ambient conditions.
• Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Industrial Control Systems  Use the device’s industrial temperature range and plentiful I/O to implement motor control, PLC functions or sensor interfacing in factory environments.
• Embedded Signal Processing  Deploy logic resources and on-chip RAM for finite impulse response (FIR) filtering, data formatting or real-time pre-processing tasks.
• Interface Bridging and Glue Logic  Leverage 251 I/O pins and programmable logic to bridge disparate buses, adapt peripheral protocols or consolidate multiple discrete components.
• Prototyping and Custom Hardware  Ideal for development platforms that require reprogrammable logic, moderate capacity and a compact BGA package for realistic system evaluation.

Unique Advantages

• Substantial programmable capacity: 8,064 logic elements support integration of diverse digital functions without immediate scale-up to larger families.
• Integrated on-chip RAM: Approximately 0.37 Mbits of embedded memory reduces dependence on external SRAM for small buffering and state storage.
• High I/O density: 251 user I/O simplifies board-level interfacing and reduces the need for additional I/O expanders.
• Compact high-density package: 320-FBGA (19×19) balances pin count and PCB area for space-constrained designs.
• Industrial robustness: Rated for −40 °C to 100 °C operation to maintain reliability in demanding environments.
• Low-voltage core: 1.14–1.26 V supply range suitable for modern low-voltage system domains.

Why Choose XC3S400A-4FGG320I?

The XC3S400A-4FGG320I positions itself as a practical mid-density Spartan®-3A FPGA choice where a combination of moderate logic capacity, significant I/O and on-chip memory is required. Its industrial rating and compact 320-BGA package make it suitable for embedded designs that must operate reliably across a wide temperature range while conserving board space.

Designers and procurement teams can rely on the device’s balance of integration, I/O flexibility and embedded memory to reduce system BOM and simplify board-level architecture for control, interface and prototyping applications.

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