XC3S400A-4FG400I

IC FPGA 311 I/O 400FBGA
Part Description

Spartan®-3A Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA

Quantity 878 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package400-FBGA (21x21)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case400-BGANumber of I/O311Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs896Number of Logic Elements/Cells8064
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits368640

Overview of XC3S400A-4FG400I – Spartan®-3A Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA

The XC3S400A-4FG400I is a Spartan®-3A family FPGA IC from AMD, delivering a programmable logic core in a compact BGA package. It provides a balance of on-chip logic, embedded memory, and I/O resources for designs that require configurable digital logic within an industrial-temperature envelope.

Key Features

  • Core Architecture Spartan-3A FPGA family implementation providing reconfigurable logic resources in an FPGA IC.
  • Logic Resources 896 CLBs and 8,064 logic elements enable implementation of medium-complexity digital functions and custom logic blocks.
  • Embedded Memory Approximately 0.369 Mbits of on-chip RAM (368,640 total RAM bits) for data buffering, packet storage, and small embedded memory requirements.
  • I/O Capability 311 I/O pins to support a wide variety of external interfaces and system-level connectivity.
  • Power Operates from a core supply in the range of 1.14 V to 1.26 V for the FPGA core domain.
  • Package & Mounting 400-ball BGA package (400-FBGA, 21 × 21) with surface-mount mounting for compact board integration.
  • Thermal & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
  • Environmental Compliance RoHS compliant material status.

Unique Advantages

  • High integration density: 8,064 logic elements and 896 CLBs provide substantial programmable resources in a single device, reducing the need for multiple discrete components.
  • Ample embedded memory: Approximately 0.369 Mbits of on-chip RAM supports buffering and local data storage without external memory in many use cases.
  • Robust I/O count: 311 I/Os enable flexible interfacing to peripherals, sensors, and external logic networks.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments.
  • Compact BGA packaging: 400-FBGA (21 × 21) enables a small PCB footprint and high pin density for space-constrained designs.
  • Low-voltage core operation: Core supply range of 1.14 V to 1.26 V helps align power budgeting for modern low-voltage systems.

Why Choose XC3S400A-4FG400I?

The XC3S400A-4FG400I delivers a balanced combination of programmable logic density, embedded memory, and a high I/O count in a compact 400-BGA package from AMD. Its industrial temperature rating and RoHS compliance make it suitable for designs that demand reliability and regulatory alignment across a range of deployment environments.

This device is well suited for engineers and procurement teams seeking a mid-range Spartan-3A FPGA with clear, verifiable specifications for logic resources, memory, I/O, power, and packaging—providing a scalable building block for configurable digital designs.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC3S400A-4FG400I.

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