XC3S400A-4FG400I
| Part Description |
Spartan®-3A Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA |
|---|---|
| Quantity | 878 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-FBGA (21x21) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-BGA | Number of I/O | 311 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 896 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 368640 |
Overview of XC3S400A-4FG400I – Spartan®-3A Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA
The XC3S400A-4FG400I is a Spartan®-3A family FPGA IC from AMD, delivering a programmable logic core in a compact BGA package. It provides a balance of on-chip logic, embedded memory, and I/O resources for designs that require configurable digital logic within an industrial-temperature envelope.
Key Features
- Core Architecture Spartan-3A FPGA family implementation providing reconfigurable logic resources in an FPGA IC.
- Logic Resources 896 CLBs and 8,064 logic elements enable implementation of medium-complexity digital functions and custom logic blocks.
- Embedded Memory Approximately 0.369 Mbits of on-chip RAM (368,640 total RAM bits) for data buffering, packet storage, and small embedded memory requirements.
- I/O Capability 311 I/O pins to support a wide variety of external interfaces and system-level connectivity.
- Power Operates from a core supply in the range of 1.14 V to 1.26 V for the FPGA core domain.
- Package & Mounting 400-ball BGA package (400-FBGA, 21 × 21) with surface-mount mounting for compact board integration.
- Thermal & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
- Environmental Compliance RoHS compliant material status.
Unique Advantages
- High integration density: 8,064 logic elements and 896 CLBs provide substantial programmable resources in a single device, reducing the need for multiple discrete components.
- Ample embedded memory: Approximately 0.369 Mbits of on-chip RAM supports buffering and local data storage without external memory in many use cases.
- Robust I/O count: 311 I/Os enable flexible interfacing to peripherals, sensors, and external logic networks.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments.
- Compact BGA packaging: 400-FBGA (21 × 21) enables a small PCB footprint and high pin density for space-constrained designs.
- Low-voltage core operation: Core supply range of 1.14 V to 1.26 V helps align power budgeting for modern low-voltage systems.
Why Choose XC3S400A-4FG400I?
The XC3S400A-4FG400I delivers a balanced combination of programmable logic density, embedded memory, and a high I/O count in a compact 400-BGA package from AMD. Its industrial temperature rating and RoHS compliance make it suitable for designs that demand reliability and regulatory alignment across a range of deployment environments.
This device is well suited for engineers and procurement teams seeking a mid-range Spartan-3A FPGA with clear, verifiable specifications for logic resources, memory, I/O, power, and packaging—providing a scalable building block for configurable digital designs.
Request a quote or submit a purchase inquiry to receive pricing and availability for the XC3S400A-4FG400I.

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