XC3S4000-5FGG900C

The XC3S4000-5FGG900C is a Spartan®-3 Field Programmable Gate Array from AMD. It delivers a programmable logic solution with 62,208 logic elements and approximately 1.77 Mbits of embedded RAM for implementing complex digital functions.

This device integrates a high I/O count (633 pins) and around 4,000,000 gates in a 900‑ball BGA package, operating from a 1.14 V to 1.26 V core supply and specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity 62,208 logic elements provide the fabric for implementing combinational and sequential logic functions.
• Embedded Memory Approximately 1.77 Mbits of on‑chip RAM for buffering, state retention, and lookup table storage.
• I/O and Gate Count 633 user I/Os and roughly 4,000,000 gates to support dense interfacing and substantial logic implementation.
• Power Core voltage supply range of 1.14 V to 1.26 V for defined power budgeting and supply design.
• Package and Mounting 900‑BBGA package (supplier package: 900‑FBGA, 31×31) with surface‑mount mounting for compact PCB integration.
• Operating Range and Compliance Commercial grade device rated for 0 °C to 85 °C and RoHS compliant.

Unique Advantages

• High logic density: 62,208 logic elements enable implementation of significant custom logic without external glue logic.
• Significant on‑chip memory: Approximately 1.77 Mbits of embedded RAM reduces reliance on external memory for many designs.
• Extensive I/O capability: 633 I/Os accommodate multiple interfaces and parallel connections directly from the FPGA.
• Compact BGA footprint: 900‑BBGA surface‑mount package supports dense PCB layouts and reliable soldering for volume production.
• Defined power envelope: Narrow core voltage range simplifies power-supply design and verification.
• Regulatory readiness: RoHS compliance supports environmentally conscious product designs.

Why Choose XC3S4000-5FGG900C?

The XC3S4000-5FGG900C positions itself as a balanced FPGA option combining substantial logic capacity, embedded RAM, and a high I/O count in a compact 900‑ball BGA package. Its defined core voltage range and commercial operating temperature make it suitable for a wide range of general-purpose programmable logic designs.

Backed by AMD, this device offers a blend of integration and scalability for engineering teams seeking a programmable solution with clear electrical and mechanical characteristics, straightforward PCB integration, and environmental compliance.

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