XC3S400A-4FG400C

IC FPGA 311 I/O 400FBGA
Part Description

Spartan®-3A Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA

Quantity 1,627 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package400-FBGA (21x21)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-BGANumber of I/O311Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs896Number of Logic Elements/Cells8064
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits368640

Overview of XC3S400A-4FG400C – Spartan®-3A FPGA, 400-BGA

The XC3S400A-4FG400C is a Spartan®-3A Field Programmable Gate Array (FPGA) in a 400-BGA package. It provides a compact, surface-mount FPGA solution featuring 8,064 logic elements, approximately 0.369 Mbits of embedded memory, and a 311-pin I/O footprint for dense system integration.

Designed for commercial-grade applications, this device operates from a 1.14 V to 1.26 V core supply and supports an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant and is supplied in a 400-FBGA (21×21) package to simplify board-level assembly and routing.

Key Features

  • Logic Capacity — 8,064 logic elements provide the core programmable fabric for implementing custom logic, state machines, and control functions.
  • Embedded Memory — Approximately 0.369 Mbits of on-chip RAM (368,640 bits) for buffering, FIFOs, and small data stores.
  • I/O and Gate Count — 311 I/O pins and 400,000 gates to support complex interfacing and integration of multiple peripherals.
  • Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and power-management designs.
  • Package and Mounting — 400-BGA surface-mount package, supplier device package 400-FBGA (21×21), optimized for compact PCB layouts.
  • Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Environmental Compliance — RoHS compliant for environmentally conscious designs and regulatory alignment.

Unique Advantages

  • Compact, high-density package: The 400-BGA (21×21) footprint enables high logic and I/O density in a small board area, reducing overall system size.
  • Balanced logic and memory resources: 8,064 logic elements paired with ~0.369 Mbits of embedded RAM support moderate-complexity designs without external memory.
  • Generous I/O count: 311 I/O pins allow direct interfacing to numerous peripherals and external devices, simplifying system-level design.
  • Low-voltage core operation: The 1.14 V–1.26 V supply range aligns with modern low-voltage power architectures for efficient integration.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet a wide range of standard commercial applications.
  • Regulatory readiness: RoHS compliance supports manufacturing and regulatory requirements for many global markets.

Why Choose XC3S400A-4FG400C?

The XC3S400A-4FG400C delivers a practical combination of logic capacity, embedded memory, and a high I/O count in a compact 400-BGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a broad set of standard electronic designs that require a mid-range FPGA with robust integration features.

This device is well suited for designers who need a scalable, surface-mount FPGA solution that balances on-chip resources with board-level density and power constraints. The specified core voltage range and package details support straightforward system integration and manufacturing.

Request a quote or submit an inquiry to learn about availability and pricing for the XC3S400A-4FG400C. Our team can provide part availability and sample information to support your design cycle.

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