XC3S400A-4FG400C
| Part Description |
Spartan®-3A Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA |
|---|---|
| Quantity | 1,627 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-FBGA (21x21) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-BGA | Number of I/O | 311 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 896 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 368640 |
Overview of XC3S400A-4FG400C – Spartan®-3A FPGA, 400-BGA
The XC3S400A-4FG400C is a Spartan®-3A Field Programmable Gate Array (FPGA) in a 400-BGA package. It provides a compact, surface-mount FPGA solution featuring 8,064 logic elements, approximately 0.369 Mbits of embedded memory, and a 311-pin I/O footprint for dense system integration.
Designed for commercial-grade applications, this device operates from a 1.14 V to 1.26 V core supply and supports an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant and is supplied in a 400-FBGA (21×21) package to simplify board-level assembly and routing.
Key Features
- Logic Capacity — 8,064 logic elements provide the core programmable fabric for implementing custom logic, state machines, and control functions.
- Embedded Memory — Approximately 0.369 Mbits of on-chip RAM (368,640 bits) for buffering, FIFOs, and small data stores.
- I/O and Gate Count — 311 I/O pins and 400,000 gates to support complex interfacing and integration of multiple peripherals.
- Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and power-management designs.
- Package and Mounting — 400-BGA surface-mount package, supplier device package 400-FBGA (21×21), optimized for compact PCB layouts.
- Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance — RoHS compliant for environmentally conscious designs and regulatory alignment.
Unique Advantages
- Compact, high-density package: The 400-BGA (21×21) footprint enables high logic and I/O density in a small board area, reducing overall system size.
- Balanced logic and memory resources: 8,064 logic elements paired with ~0.369 Mbits of embedded RAM support moderate-complexity designs without external memory.
- Generous I/O count: 311 I/O pins allow direct interfacing to numerous peripherals and external devices, simplifying system-level design.
- Low-voltage core operation: The 1.14 V–1.26 V supply range aligns with modern low-voltage power architectures for efficient integration.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet a wide range of standard commercial applications.
- Regulatory readiness: RoHS compliance supports manufacturing and regulatory requirements for many global markets.
Why Choose XC3S400A-4FG400C?
The XC3S400A-4FG400C delivers a practical combination of logic capacity, embedded memory, and a high I/O count in a compact 400-BGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a broad set of standard electronic designs that require a mid-range FPGA with robust integration features.
This device is well suited for designers who need a scalable, surface-mount FPGA solution that balances on-chip resources with board-level density and power constraints. The specified core voltage range and package details support straightforward system integration and manufacturing.
Request a quote or submit an inquiry to learn about availability and pricing for the XC3S400A-4FG400C. Our team can provide part availability and sample information to support your design cycle.

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Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








