XC3S400A-4FGG400C

The XC3S400A-4FGG400C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC from AMD. It delivers 8,064 logic elements, approximately 0.37 Mbits of embedded RAM, and 311 I/O pins in a compact 400-BGA package.

Designed as a commercial-grade, surface-mount FPGA, the device operates from a 1.14–1.26 V supply and across an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic 8,064 logic elements provide the programmable fabric for implementing custom digital logic functions.
• Configurable Logic Blocks Listed architecture includes 896 CLBs to organize and structure logic resources.
• Embedded Memory Approximately 0.37 Mbits of on-chip RAM (368,640 bits) for data buffering and state storage.
• I/O and Gate Count 311 user I/O pins and approximately 400,000 gates to support broad interfacing and integration.
• Power Core supply voltage range of 1.14–1.26 V for defined power delivery and system design.
• Package and Mounting 400-BGA (400-FBGA, 21 × 21) surface-mount package suited for compact, high-density PCB layouts.
• Operating Conditions Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom digital systems — Implement tailored logic and state machines using the device's programmable fabric and logic element count.
• I/O-dense interfaces — Use 311 I/O pins to connect multiple peripherals and I/O channels directly to the FPGA.
• On-chip buffering and control — Leverage approximately 0.37 Mbits of embedded RAM for local data storage, FIFOs, and control structures.
• Compact board designs — The 400-FBGA (21×21) surface-mount package enables high-density PCB implementations.

Unique Advantages

• Substantial logic capacity: 8,064 logic elements provide a solid baseline for implementing medium-complexity digital designs without external logic.
• Balanced on-chip memory: Approximately 0.37 Mbits of embedded RAM supports data buffering and state retention within the FPGA fabric.
• High I/O count: 311 I/O pins allow flexible interfacing to sensors, peripherals, and external buses.
• Compact, surface-mount package: 400-FBGA (21×21) offers a small footprint for space-constrained PCBs while maintaining thermal and routing characteristics of a BGA.
• Defined power and thermal envelope: Core supply of 1.14–1.26 V and commercial operating range of 0 °C to 85 °C simplify system-level power and thermal planning.
• RoHS compliance: Meets environmental requirements for lead-free assembly and regulatory considerations.

Why Choose XC3S400A-4FGG400C?

The XC3S400A-4FGG400C positions itself as a capable Spartan‑3A FPGA for designs requiring a balance of logic capacity, on-chip memory, and I/O density in a compact BGA package. Its commercial-grade operating range and defined supply requirements make it suitable for a wide range of standard embedded and digital applications.

Engineers and procurement teams can rely on the device’s combination of 8,064 logic elements, approximately 0.37 Mbits of embedded RAM, and 311 I/O pins to simplify system integration, reduce external components, and maintain a compact board footprint while meeting RoHS requirements.

Request a quote or submit your procurement inquiry to receive pricing and availability for the XC3S400A-4FGG400C.