XC3S400A-4FGG400I

The XC3S400A-4FGG400I is a Spartan®-3A field programmable gate array (FPGA) from AMD provided in a 400-ball BGA package. It delivers a balance of programmable logic resources, embedded memory, and high I/O count for industrial-grade applications.

With 8,064 logic elements and approximately 0.37 Mbits of embedded memory, this device targets designs that require moderate on-chip logic capacity, a large number of external interfaces, and operation across an extended industrial temperature range.

Key Features

• Programmable Logic 8,064 logic elements available for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.37 Mbits of on-chip RAM (368,640 total RAM bits) for data buffering and small lookup tables.
• I/O Capacity Up to 311 user I/Os to support multiple interfaces and external peripherals.
• Gate Equivalent Approximately 400,000 gates to describe device scale and integration potential.
• Package & Mounting 400-BGA (400-FBGA, 21×21) surface-mount package for compact board integration.
• Power Core supply range of 1.14 V to 1.26 V to match system power-rail planning.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control Use in automation and control equipment that requires programmable logic, numerous I/Os, and industrial temperature capability.
• Embedded Systems Integration into embedded platforms needing moderate on-chip logic and embedded RAM for control tasks and glue logic.
• I/O-Intensive Designs Applications that require many external signals or interfaces can leverage the device’s 311 I/Os for connectivity.

Unique Advantages

• Balanced Logic Capacity: 8,064 logic elements provide a practical level of integration for mid-size designs without excessive BOM complexity.
• On-Chip Memory for Local Storage: Approximately 0.37 Mbits of embedded RAM enables local buffering and small data structures without external memory.
• High I/O Count: 311 I/Os allow direct interfacing to numerous peripherals and external devices, reducing the need for external I/O expanders.
• Compact BGA Package: The 400-FBGA (21×21) package delivers a high-density footprint for space-constrained PCBs.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsher environments where thermal range matters.
• Regulatory Compliance: RoHS compliance assists with environmental and manufacturing requirements.

Why Choose XC3S400A-4FGG400I?

The XC3S400A-4FGG400I is positioned for designers who need a mid-range Spartan®-3A FPGA offering a practical mix of logic resources, embedded memory, and a high I/O count in a compact 400-BGA package. Its industrial temperature rating and RoHS compliance make it suitable for production systems that must meet environmental and durability constraints.

This device is appropriate for teams building embedded controllers, I/O-rich modules, or compact FPGA-based subsystems that require predictable on-chip resources and straightforward board-level integration. The combination of core voltage range, package density, and available logic provides a clear basis for system-level planning and long-term deployment.

Request a quote or contact sales to check pricing and availability for the XC3S400A-4FGG400I and to discuss how it fits your next design.