XC3S4000L-4FGG900C

The XC3S4000L-4FGG900C is a Spartan®-3L Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-capacity programmable fabric with a large number of logic elements, embedded memory, and I/O resources for logic-intensive designs.

This device is specified with up to 62,208 logic elements, approximately 1.77 Mbits of embedded memory, and 633 I/O pins in a 900-ball BGA package, making it suitable for commercial-grade applications that require substantial on-chip resources and high I/O density.

Key Features

• Logic Capacity — Provides 62,208 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM for data buffering, state storage, and small memory structures.
• I/O Density — 633 I/O pins to support extensive peripheral interfacing and high-pin-count board designs.
• Gate Count — Rated at 4,000,000 gates, enabling sizeable digital designs within a single device.
• Package and Mounting — 900-BBGA package; supplier device package listed as 900-FBGA (31×31). Surface-mount mounting type for standard PCB assembly.
• Power Supply — Core voltage supply range of 1.14 V to 1.26 V for device operation.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• High on-chip integration: Large logic element count and substantial embedded memory reduce the need for external components and simplify system design.
• Extensive I/O support: 633 I/O pins accommodate multiple interfaces and high-pin-count peripherals without additional multiplexing hardware.
• Compact, assembly-friendly package: 900-ball BGA in a 31×31 footprint supports dense board layouts and surface-mount assembly processes.
• Commercial temperature suitability: Specified 0 °C to 85 °C operating range for typical commercial applications.
• Standards-aligned compliance: RoHS compliance supports environmentally conscious product designs and regulatory requirements.

Why Choose XC3S4000L-4FGG900C?

Manufactured by AMD, the XC3S4000L-4FGG900C combines a large logic fabric, significant embedded memory, and high I/O count in a compact 900-BBGA package. These attributes make it well suited for commercial designs that require substantial on-chip logic and memory capacity while maintaining a surface-mount form factor.

Choose this FPGA when your design calls for a high number of logic elements, sizeable on-chip RAM, and broad I/O capability within a commercial temperature range—offering a balance of integration and board-level density for complex digital systems.

Request a quote or submit an inquiry to purchase the XC3S4000L-4FGG900C and include your required quantity and lead-time expectations for a prompt response.