XC3S4000-4FGG900C

The XC3S4000-4FGG900C is a Spartan®-3 field programmable gate array (FPGA) designed for complex, configurable digital designs. It offers a combination of dense logic resources, on-chip memory, and a high I/O count in a 900-ball BGA package for surface-mount assembly.

With 62,208 logic elements, approximately 1.77 Mbits of embedded memory and 633 I/O pins, this commercial-grade FPGA targets applications that require substantial integration and flexible reprogrammable logic within a 1.14 V–1.26 V supply envelope and an operating range of 0 °C to 85 °C.

Key Features

• Logic Capacity The device provides 62,208 logic elements, enabling implementation of large-scale custom logic designs and complex state machines.
• Embedded Memory Approximately 1.77 Mbits of on-chip RAM supports buffering, packet processing, and intermediate data storage without external memory.
• I/O Density 633 user I/O pins allow broad connectivity to peripherals, external devices, and parallel interfaces.
• Gate Count Approximately 4,000,000 gates for rich logic and interconnect resources.
• Package & Mounting 900-ball BGA package (supplier device package: 900-FBGA, 31×31) designed for surface-mount PCB assembly and high-density board layouts.
• Power Core supply range of 1.14 V to 1.26 V to match system power architectures that use low-voltage FPGA cores.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for typical commercial-environment applications.
• Environmental Compliance RoHS compliant for regulatory and assembly considerations.

Typical Applications

• High-density digital logic Implement large programmable logic blocks and custom accelerators using the device’s 62,208 logic elements and ~1.77 Mbits of embedded memory.
• High‑I/O systems Leverage 633 I/O pins for designs requiring broad peripheral interfacing, parallel buses, or multiple external connections.
• Embedded processing and buffering Use on-chip RAM to handle data buffering, packet staging, or intermediate storage within data-path and control logic.

Unique Advantages

• High integration density: 62,208 logic elements and ~1.77 Mbits of embedded memory consolidate complex functions inside a single FPGA, reducing external components.
• Extensive I/O resources: 633 I/O pins simplify board-level interfacing and reduce the need for external multiplexing or I/O expanders.
• Compact BGA packaging: 900-ball package enables high-density PCB layouts while supporting surface-mount manufacturing processes.
• Large gate count for complex designs: Approximately 4,000,000 gates provide the capacity needed for sophisticated logic and interconnect networks.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements in commercial production.

Why Choose XC3S4000-4FGG900C?

The XC3S4000-4FGG900C positions itself as a high-capacity, commercial-grade Spartan®-3 FPGA suitable for designs that require a combination of significant logic resources, embedded memory, and a large number of I/O pins in a compact BGA package. Its electrical and thermal ratings—1.14 V to 1.26 V core supply and 0 °C to 85 °C operating temperature—align with common commercial system requirements.

This FPGA is appropriate for engineering teams and procurement seeking a reusable, reprogrammable device that consolidates functions to reduce board complexity and parts count while maintaining compliance with RoHS assembly practices.

If you would like pricing information or to request a quote for the XC3S4000-4FGG900C, please submit a quote request or contact our sales team to discuss availability and volume options.