XC3S4000-4FG900C

The XC3S4000-4FG900C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD, offering a high-density programmable logic fabric in a 900-ball BGA package. It combines a large population of logic resources and I/O connectivity with on-chip embedded RAM to support a broad range of programmable-logic designs.

Key attributes include 6,912 CLBs, 62,208 logic elements, approximately 1.77 Mbits of embedded memory, and 633 user I/Os, providing designers with the capacity to implement complex digital functions while maintaining a compact surface-mount footprint.

Key Features

• Logic Resources  6,912 CLBs and 62,208 logic elements provide substantial programmable fabric for implementing combinational and sequential logic.
• Embedded Memory  Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) supports buffering, lookup tables, and state storage without external memory.
• I/O Capability  633 user I/Os allow extensive external interfacing and flexible board-level connectivity for peripherals and system interfaces.
• Gate Equivalent  Approximately 4,000,000 gates of logic capacity for medium- to high-complexity designs.
• Package and Mounting  900-BBGA package (supplier device package: 900-FBGA 31×31) in a surface-mount form factor simplifies PCB layout for space-constrained applications.
• Power Supply  Operates from a core supply range of 1.14 V to 1.26 V, enabling predictable power planning for system power domains.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C suitable for standard commercial applications.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Unique Advantages

• High logic density: 62,208 logic elements and ~4 million gates provide the capacity to consolidate multiple functions into a single device, reducing BOM count.
• Significant embedded RAM: Approximately 1.77 Mbits of on-chip memory reduces reliance on external memory for buffering and state retention, simplifying board design.
• Extensive I/O count: 633 user I/Os enable broad connectivity for sensors, interfaces, and peripheral subsystems without additional multiplexing logic.
• Compact surface-mount package: The 900-ball FBGA (31×31) format offers a compact footprint for high-density assemblies while maintaining a high pin count.
• Commercial temperature rating: 0 °C to 85 °C supports typical commercial deployments and standard operating environments.
• RoHS compliance: Conforms to lead-free manufacturing requirements for regulatory and environmental consistency.

Why Choose XC3S4000-4FG900C?

The XC3S4000-4FG900C positions itself as a high-capacity, commercially graded FPGA suited for designs that require substantial logic resources, embedded memory, and a large number of I/Os in a compact surface-mount package. Its combination of CLBs, logic elements, and on-chip RAM enables integration of complex digital functions while minimizing external components.

This FPGA is appropriate for development teams and procurement groups seeking a programmable-logic device that balances integration, predictable power requirements, and RoHS-compliant manufacturing. The package and commercial temperature rating make it suitable for a wide range of standard electronic products and engineered systems.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S4000-4FG900C and to discuss lead times and purchasing options.