XC3S4000-4FGG676I

The XC3S4000-4FGG676I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It provides a high on-chip logic capacity with substantial embedded memory and a large I/O count in a compact 676-ball BGA package.

Designed for applications that require dense programmable logic, significant embedded RAM, and broad I/O connectivity, this device delivers configurable resources while supporting industrial operating temperatures and a narrow core supply voltage range.

Key Features

• Logic Capacity  62208 logic elements provide significant on-chip programmable logic for complex digital implementations.
• Embedded Memory  Approximately 1.77 Mbits of on-chip RAM (1,769,472 total RAM bits) to support buffering, state storage, and memory-intensive logic functions.
• Gate Count  Approximately 4,000,000 gates for large-scale logic integration and system-level implementations.
• I/O Density  489 user I/O pins to enable extensive external connectivity and interface options.
• Package & Mounting  676-ball FBGA (27 × 27) package in a surface-mount form factor for compact board-level integration.
• Power  Core supply voltage range of 1.14 V to 1.26 V for the device core.
• Temperature Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital implementations  Use the large logic element count and gate density for complex custom logic and state-machine designs.
• Memory-aware processing  Leverage approximately 1.77 Mbits of embedded RAM for buffering, packet handling, or on-chip data storage.
• Interface aggregation  Employ the 489 I/O pins for systems requiring multiple parallel or serial interfaces and extensive external device connectivity.
• Industrial control and monitoring  Industrial temperature rating supports deployment in control equipment and factory automation where wider temperature ranges are required.

Unique Advantages

• High on-chip logic capacity: 62208 logic elements enable consolidation of multiple functions into a single device, simplifying board-level design.
• Substantial embedded RAM: Approximately 1.77 Mbits of on-chip memory reduces dependence on external memory for many control and buffering tasks.
• Extensive I/O count: 489 user I/O pins allow flexible interfacing to sensors, peripherals, and system buses without extensive external multiplexing.
• Compact BGA packaging: 676-FBGA (27×27) supports high-density board layouts while keeping the device footprint manageable.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• RoHS compliant: Meets RoHS requirements for environmental and regulatory conformity.

Why Choose XC3S4000-4FGG676I?

The XC3S4000-4FGG676I combines a high count of logic elements, substantial embedded memory, and a wide I/O complement in a compact FBGA package, making it suitable for designs that require significant on-chip integration within industrial temperature envelopes. With a defined core voltage range and robust gate count, it supports consolidation of complex digital functions into a single programmable device.

Manufactured by AMD, this Spartan®-3 FPGA option is aimed at engineers and procurement teams seeking a programmable logic device that balances logic capacity, embedded memory, and connectivity while meeting industrial operating requirements.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S4000-4FGG676I. Our team can provide the details needed to integrate this FPGA into your next design.