XC3S400-5FTG256C

The XC3S400-5FTG256C is a Spartan®-3 field programmable gate array (FPGA) from AMD, delivered in a 256-LBGA package. It provides a balanced combination of logic resources, embedded memory and I/O capacity for commercial electronic designs.

Key electrical and environmental parameters include a supply voltage window of 1.14 V to 1.26 V, an operating temperature range of 0 °C to 85 °C, surface-mount packaging and RoHS compliance.

Key Features

• Core Logic 896 configurable logic blocks (CLBs) and 8,064 logic elements provide programmable logic capacity supporting mid-range designs; specified equivalence of approximately 400,000 gates.
• Embedded Memory Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for local data buffering and state storage.
• I/O Capacity 173 general-purpose I/O pins to support a wide range of board-level interfaces and signal routing requirements.
• Power Supply Operates from a core supply in the range of 1.14 V to 1.26 V, enabling predictable power budgeting for system designs.
• Package & Mounting 256-LBGA (supplier package: 256-FTBGA, 17 × 17) in a surface-mount form factor for compact PCB integration.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance RoHS compliant, supporting lead-free assembly processes.

Typical Applications

• Commercial electronic systems — Implement custom logic and control functions in commercial-grade equipment using the device’s logic and I/O resources.
• Board-level integration — Surface-mount 256-LBGA package and 173 I/O pins facilitate dense PCB implementations requiring a compact programmable logic device.
• Embedded memory and buffering — Approximately 0.295 Mbits of on-chip RAM supports local buffering, small FIFOs and state storage within constrained designs.

Unique Advantages

• Balanced logic density: 8,064 logic elements and 896 CLBs deliver a mid-range FPGA resource set suitable for many commercial designs without unnecessary overhead.
• On-chip memory: Nearly 0.295 Mbits of embedded RAM reduces reliance on external memory for moderate buffering and temporary data storage.
• Generous I/O count: 173 I/O pins enable flexible interfacing options for peripherals, sensors and board-level connections.
• Compact packaging: 256-LBGA (17 × 17 FTBGA) surface-mount package supports high-density PCB layouts and streamlined assembly.
• Predictable electrical profile: Narrow core supply range (1.14 V–1.26 V) simplifies power-supply planning and thermal considerations within the specified operating range.
• Regulatory-ready: RoHS compliance supports lead-free manufacturing flows.

Why Choose XC3S400-5FTG256C?

The XC3S400-5FTG256C provides a practical balance of logic elements, embedded RAM and I/O capacity in a compact 256-LBGA surface-mount package from AMD. It is positioned for commercial applications that require moderate programmable logic resources, on-chip memory for buffering, and a sizeable pin count for board-level interfacing.

Engineers and procurement teams can rely on the device’s clear electrical and thermal parameters—1.14 V to 1.26 V supply and 0 °C to 85 °C operating range—combined with RoHS compliance to simplify integration into commercial product designs.

Request a quote or submit a purchase inquiry for the XC3S400-5FTG256C to learn about availability and pricing for your next design.