XC3S400-5FGG456C

The XC3S400-5FGG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD, provided in a 456-ball BGA package. It delivers a mid-range programmable logic resource set suitable for commercial-grade embedded and communications designs that require moderate logic density, substantial I/O capacity, and on-chip memory.

With 8064 logic elements, approximately 294,912 bits (~0.295 Mbits) of embedded RAM, and 264 I/O pins in a compact surface-mount 456-BBGA (23×23) package, this device balances integration and board-level density while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 8064 logic elements provide programmable resources for mid-sized digital designs.
• Embedded Memory  Approximately 294,912 bits (~0.295 Mbits) of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Count  264 I/O pins to support a wide variety of peripheral interfaces and parallel connections without excessive external expansion.
• Gate Equivalent  Approximately 400,000 gates for mapping combinational and sequential logic functions.
• Power Supply  Specified operating core voltage range of 1.14 V to 1.26 V for system power planning.
• Package & Mounting  456-ball BGA (23×23) surface-mount package designed for compact, high-density PCB assemblies.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Prototyping & Development  Flexible programmable logic for proof-of-concept designs and hardware validation in commercial projects.
• Consumer Electronics  Custom control, interface bridging, and feature integration in commercial electronic products.
• Communications Equipment  Protocol handling, data interfacing, and glue logic in commercial communications systems.
• Embedded Control Systems  Implementation of custom control logic, I/O aggregation, and timing functions for embedded solutions.
• Test & Measurement  Custom signal routing, data preprocessing, and control tasks in commercial test equipment.

Unique Advantages

• Balanced Logic Density:  8064 logic elements offer a practical resource set for mid-range designs without unnecessary complexity.
• High I/O Integration:  264 I/Os reduce the need for external expansion components and simplify board-level connectivity.
• On-Chip Memory:  Approximately 294,912 bits of embedded RAM support buffering and local data storage to streamline system architecture.
• Compact, Serviceable Package:  The 456-BBGA (23×23) surface-mount package enables high-density PCB layouts while maintaining manufacturability.
• Commercial Temperature and Compliance:  Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product requirements.
• Predictable Power Requirements:  Defined supply range (1.14 V to 1.26 V) assists with power-supply design and thermal planning.

Why Choose XC3S400-5FGG456C?

The XC3S400-5FGG456C combines a practical balance of logic resources, on-chip memory, and extensive I/O in a compact 456-BBGA package, making it well suited for commercial embedded and communications designs that require configurable logic without excessive complexity. Its commercial temperature rating and RoHS compliance align with common production and regulatory expectations for consumer and commercial products.

This AMD Spartan®-3 FPGA is an option for engineers and procurement teams looking for a mid-range, surface-mount programmable device that supports moderate logic density, significant I/O integration, and predictable power and thermal characteristics for commercial deployments.

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