XC3S400-5FG320C

The XC3S400-5FG320C is a Spartan®-3 field programmable gate array (FPGA) in a 320-ball BGA package, designed for applications that require programmable digital logic and flexible I/O. It integrates 896 configurable logic blocks and 8,064 logic elements with on-chip embedded memory and a broad I/O count, enabling compact, reconfigurable designs in commercial-grade systems.

Key Features

• Logic Fabric  896 CLBs providing 8,064 logic elements for implementing custom digital logic.
• Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 total RAM bits) to support buffering, state storage, and small data structures.
• I/O Density  221 user I/O pins for interfacing to peripheral devices, buses, and external logic.
• Gate Capacity  Approximately 400,000 gates to describe the relative complexity and integration level available in the device.
• Power  Core supply range from 1.14 V to 1.26 V to match system power rails and regulator designs.
• Package & Mounting  320-ball BGA (320-FBGA, 19×19) package, surface-mount mounting type for high-density board layouts.
• Operating Range  Commercial temperature grade: 0 °C to 85 °C for typical commercial electronics environments.
• Compliance  RoHS compliant to support lead-free assembly processes.

Typical Applications

• Embedded System Prototyping  Use the FPGA’s 8,064 logic elements and on-chip RAM to prototype custom digital functions and accelerate development cycles.
• Glue Logic and I/O Expansion  With 221 I/O pins, the device is suited for implementing interface logic, bus bridging, and custom peripheral glue logic in compact designs.
• Custom Control and Automation  Deploy the configurable logic and gate capacity to implement bespoke control algorithms and state machines in commercial equipment.

Unique Advantages

• Programmable Integration: Consolidate multiple discrete functions into programmable logic, reducing BOM and board complexity by leveraging 8,064 logic elements and 896 CLBs.
• On-Chip Memory: Approximately 0.295 Mbits of embedded RAM supports buffering and local storage without external memory, simplifying board routing and lowering component count.
• High I/O Count: 221 user I/Os enable flexible interfacing to sensors, controllers, and peripherals, helping accommodate diverse board-level requirements.
• Compact BGA Package: 320-FBGA (19×19) delivers a high-density footprint for space-constrained PCBs while supporting surface-mount assembly processes.
• Commercial Temperature Grade: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing workflows.

Why Choose XC3S400-5FG320C?

The XC3S400-5FG320C Spartan-3 FPGA combines a substantial logic fabric with embedded memory and a high I/O count in a compact 320-BGA package, making it suitable for commercial applications that need configurable digital logic and moderate on-chip storage. Its commercial temperature rating, controlled core voltage range, and RoHS compliance make it practical for production designs focused on integration and manufacturability.

This device is appropriate for engineers and designers who require a field-programmable solution to consolidate functions, implement custom interfaces, and prototype digital systems while maintaining a compact board footprint and standard commercial operating conditions.

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