XC3S400-4PQG208I

The XC3S400-4PQG208I is an AMD Spartan®-3 field programmable gate array (FPGA) supplied in a 208-pin BFQFP surface-mount package. It provides a mid-range logic capacity with a combination of logic elements, on-chip memory and I/O suitable for industrial embedded applications.

With 8,064 logic elements, approximately 0.295 Mbits of embedded memory, 141 I/O pins and an industrial temperature rating, this device is targeted at designs that require reconfigurable digital logic within a robust operating envelope.

Key Features

• Logic Capacity — 8,064 logic elements supporting up to approximately 400,000 gates to implement custom digital functions.
• Embedded Memory — Approximately 0.295 Mbits of on-chip RAM for buffering, state storage and small working datasets.
• I/O Count — 141 general-purpose I/O pins to interface with peripherals, sensors and external logic.
• Power — Core voltage supply range from 1.14 V to 1.26 V for device operation.
• Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB assembly.
• Industrial Grade & Temperature Range — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Standards Compliance — RoHS compliant for environmental regulatory adherence.

Typical Applications

• Industrial Control — Implement custom logic, motor control interfaces and I/O aggregation for factory automation systems that require industrial temperature capability.
• Embedded Systems — Provide reconfigurable logic and on-chip RAM for embedded controllers and custom peripherals in industrial equipment.
• Interface and Glue Logic — Serve as protocol adapters, bus bridges or timing controllers where multiple I/O and configurable logic are needed.

Unique Advantages

• Substantial Logic Density: 8,064 logic elements enable implementation of complex state machines and custom datapaths without external ASICs.
• On-Chip Memory for Local Storage: Approximately 0.295 Mbits of RAM reduces dependence on external memory for small buffering and registers.
• Ample I/O Count: 141 I/O pins offer flexible connectivity to sensors, actuators and peripheral devices, simplifying board-level routing.
• Industrial Reliability: Industrial grade construction and a −40 °C to 100 °C operating range support deployment in temperature-challenging environments.
• Compact Surface-Mount Package: 208-pin BFQFP (208-PQFP 28×28) provides a high-pin-count solution in a manageable PCB footprint.
• Regulatory Compliance: RoHS compliance supports environmentally conscious design and manufacturing requirements.

Why Choose XC3S400-4PQG208I?

The XC3S400-4PQG208I positions itself as a robust, mid-range Spartan®-3 FPGA from AMD that balances logic capacity, on-chip memory and generous I/O in a surface-mount 208-pin package. Its industrial grade and wide operating temperature range make it appropriate for embedded and industrial applications that require reconfigurable logic and reliable operation across challenging environments.

Designers and procurement teams seeking a vendor-backed FPGA with verifiable electrical and thermal specifications will find this device suitable for projects that demand moderate logic resources, local RAM and extensive I/O without moving to larger, more complex device families.

Request a quote or submit an inquiry for pricing and availability for the XC3S400-4PQG208I to evaluate suitability for your next design.