XC3S400-4FTG256I

The XC3S400-4FTG256I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides a mid-range balance of logic capacity, embedded memory, and I/O density in a compact 256-LBGA package for surface-mount assembly.

With 8,064 logic elements, approximately 0.295 Mbits of on-chip RAM, 173 user I/Os, and an industrial operating range, this FPGA targets designs that require reliable digital logic integration and flexible I/O handling within constrained board space.

Key Features

• Core & Logic  Spartan®-3 FPGA architecture with 8,064 logic elements and 896 CLBs to implement combinational and sequential digital logic.
• Embedded Memory  Approximately 0.295 Mbits (294,912 bits) of on-chip RAM for local storage and buffering.
• I/O & Package  173 user I/Os in a 256-LBGA package (supplier package: 256-FTBGA, 17×17); surface-mount mounting for compact board layouts.
• Logic Density  Approximate logic equivalent of 400,000 gates to support complex glue logic and midsize digital functions.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match low-voltage system designs.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for demanding environments.
• Environmental Compliance  RoHS compliant to meet regulatory environmental requirements.

Typical Applications

• Industrial Control  Industrial-grade operation and wide temperature range enable deployment in factory automation and process control modules that require robust digital logic and multiple I/Os.
• Embedded System Integration  Mid-range logic capacity and on-chip RAM support custom embedded logic, glue logic, and simple data handling functions in embedded platforms.
• Sensor and Interface Aggregation  High I/O count supports aggregation and conditioning of signals from sensors and peripheral devices in compact form factors.
• Protocol Bridging and Glue Logic  Logic density and I/O flexibility allow implementation of protocol translation, timing adaptation, and interface bridging between system components.

Unique Advantages

• Balanced Logic Capacity: 8,064 logic elements and 896 CLBs provide a practical mid-range resource set for a wide range of digital designs without excess overhead.
• On-chip Memory: Approximately 0.295 Mbits of embedded RAM reduces external memory dependencies for local buffering and state storage.
• High I/O Density in a Compact Package: 173 user I/Os in a 256-LBGA footprint enable rich interfacing while conserving PCB area.
• Industrial Temperature Support: Rated from −40 °C to 100 °C to meet the thermal demands of industrial and harsh-environment applications.
• Low-Voltage Core Compatibility: 1.14 V to 1.26 V supply range aligns with low-voltage system designs and modern power rails.
• Regulatory Compliance: RoHS compliant to support environmentally conscious product development.

Why Choose XC3S400-4FTG256I?

The XC3S400-4FTG256I from AMD delivers a practical combination of logic resources, embedded memory, and I/O density in a reliable industrial-grade package. Its specifications make it well suited for engineers designing mid-range digital systems that require on-chip RAM, substantial I/O, and operation across a broad temperature range.

Designed for compact, surface-mount implementations, this FPGA offers a cost-effective building block for control, interfacing, and integration tasks where predictable operating conditions and RoHS compliance are important considerations.

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