XC3S400-4FGG456I

The XC3S400-4FGG456I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC configured in a 456-ball BGA package. It combines a mid-range array of programmable logic, on-chip RAM, and a high-density I/O count to support custom digital designs that require flexible logic, embedded memory, and substantial interfacing capability.

With industrial-grade operation from -40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V, this device is suited for designs that demand stable operation across a wide temperature window and board-level surface-mount integration.

Key Features

• Logic Capacity  8064 logic elements (configured from 896 CLBs) providing programmable fabric for custom digital functions and control logic.
• Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 total RAM bits) for buffering, lookup tables, and small data storage needs.
• I/O and Connectivity  264 general-purpose I/O pins to support multiple interfaces and peripheral connections without external multiplexing.
• Gate Equivalent  Approximately 400,000 gates to describe the effective implementation scale available for logic mapping and integration.
• Package and Mounting  456-BBGA package (supplier device package: 456-FBGA, 23×23) optimized for surface-mount PCB assembly and compact board footprints.
• Power  Core voltage supply range from 1.14 V to 1.26 V to match system power delivery and design constraints.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C for reliable performance in wider temperature environments.
• Compliance  RoHS compliant to meet modern environmental and manufacturing requirements.

Typical Applications

• Custom digital logic and prototyping  Implement glue logic, protocol conversion, and custom state machines using the device's programmable fabric and ample logic elements.
• Interface consolidation  Use the 264 I/O to aggregate and manage multiple peripheral signals, reducing the need for extra interface ICs.
• On-chip buffering and small data storage  Leverage approximately 0.295 Mbits of embedded RAM for FIFOs, frame buffers, and temporary data storage close to the logic.

Unique Advantages

• Balanced logic and memory mix: 8064 logic elements paired with nearly 295 Kbits of RAM provide a practical balance of programmable logic and embedded storage for moderately complex functions.
• High I/O density: 264 I/O pins allow direct connection to a wide range of peripherals and sensors, simplifying board-level design and reducing external components.
• Compact, board-ready package: The 456-BBGA (456-FBGA, 23×23) supports surface-mount assembly for space-constrained applications and modern PCB manufacturing.
• Industrial temperature rating: Specified operation from -40 °C to 100 °C supports deployment in environments with broader thermal requirements.
• Environmentally compliant: RoHS compliance aligns the device with current environmental manufacturing standards.

Why Choose XC3S400-4FGG456I?

The XC3S400-4FGG456I positions itself as a mid-range Spartan®-3 FPGA offering a practical combination of logic capacity, embedded RAM, and a high pin count in a compact BGA package. Its industrial temperature range and RoHS compliance make it suitable for designs where environmental robustness and regulatory alignment matter.

This device is well suited to engineers and teams looking to implement consolidated digital functions, interface-rich designs, or FPGA-based prototypes that require a defined balance of logic, memory, and I/O while maintaining PCB space efficiency and surface-mount compatibility.

Request a quote or submit an inquiry to receive pricing and availability details for the XC3S400-4FGG456I and to discuss how it can fit into your next design.