XC3S400-4FT256I

The XC3S400-4FT256I is a Spartan®-3 field programmable gate array (FPGA) provided in a 256-LBGA package. It combines a sizable logic fabric with embedded RAM and a broad I/O count to support industrial-grade digital designs.

This device offers 8,064 logic elements and approximately 0.295 Mbits of on-chip RAM (294,912 bits), along with 173 user I/Os and about 400,000 gates, making it suitable for industrial applications that require reprogrammable logic, dense integration, and robust operating temperature support.

Key Features

• Core Logic  Provides 8,064 logic elements for implementing custom digital logic and finite-state machines.
• Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 bits) to support buffers, FIFOs, and small embedded data structures.
• I/O Capacity  173 user I/O pins to interface with peripherals, sensors, and external logic.
• Gate Count  About 400,000 gates for mapping complex combinational and sequential logic.
• Power  Operates from a supply range of 1.14 V to 1.26 V, enabling consistent core-voltage planning in multilayer designs.
• Package & Mounting  Available in a 256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting suitable for compact PCB layouts.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C and specified as industrial grade for use in harsher environments.
• RoHS Compliance  RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Industrial control and automation  Use the device’s 173 I/Os and industrial temperature rating to interface with sensors, actuators, and control buses in factory-floor equipment.
• Embedded digital processing  Leverage 8,064 logic elements and ~0.295 Mbits of on-chip RAM to implement custom state machines, protocol handling, and preprocessing tasks.
• Interface bridging and prototyping  Deploy the FPGA for protocol conversion, glue logic, and hardware prototypes where reprogrammability and a high I/O count accelerate development.

Unique Advantages

• Significant logic density: 8,064 logic elements enable implementation of substantial custom digital functions without external ASICs.
• Embedded memory on-chip: Approximately 0.295 Mbits of RAM reduces the need for external buffering in many control and data-path applications.
• High I/O count: 173 user I/Os simplify direct interfacing to sensors, buses, and peripherals, reducing glue logic.
• Industrial-ready operation: Rated from −40°C to 100°C for deployments in industrial environments with wider temperature requirements.
• Compact, surface-mount package: 256-LBGA (256-FTBGA, 17×17) supports space-constrained PCB designs while maintaining a robust pinout.
• Regulatory friendliness: RoHS compliance supports lead-free assembly and modern manufacturing flows.

Why Choose XC3S400-4FT256I?

The XC3S400-4FT256I positions itself as an industrial-grade Spartan®-3 FPGA option that balances logic capacity, embedded memory, and a substantial I/O complement in a compact 256-LBGA footprint. Its specified voltage supply range and operating temperature make it suitable for designers targeting durable, reprogrammable logic solutions in industrial contexts.

Engineers and procurement teams targeting applications that require on-board programmability, moderate embedded memory, and high I/O density will find this device suitable for reducing external component count and accelerating time-to-market while adhering to RoHS requirements.

Request a quote or submit a purchase inquiry to evaluate the XC3S400-4FT256I for your next industrial FPGA design.