XC3S400-4PQ208C

The XC3S400-4PQ208C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD designed for commercial-grade programmable logic applications. It integrates a balanced mix of logic capacity, on-chip memory and I/O to support mid-density custom logic implementations.

Key device characteristics include 8,064 logic elements, approximately 0.295 Mbits of embedded memory, 141 general-purpose I/Os and an estimated 400,000 gates. The device is supplied in a 208-BFQFP surface-mount package and operates from a 1.14 V to 1.26 V core supply within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic Capacity — Contains 8,064 logic elements suitable for mid-density programmable logic functions and custom digital implementations.
• Embedded Memory — Approximately 0.295 Mbits of on-chip RAM for buffers, FIFOs and small on-chip data storage.
• I/O Resources — 141 I/O pins to support multiple external interfaces and board-level signal routing.
• Gate Count — An estimated 400,000 gates providing a practical measure of overall device complexity.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting — 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for PCB integration.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Commercial embedded systems — Mid-density programmable logic for control, interfacing and protocol handling in commercial products.
• Prototyping and development — Implement and iterate custom logic designs using a commercially graded Spartan‑3 FPGA with substantial on-chip resources.
• Board-level glue logic — Consolidate multiple discrete functions using the device’s 141 I/Os and 8,064 logic elements to reduce component count.
• Memory buffering and data handling — Use approximately 0.295 Mbits of embedded RAM for temporary data storage, FIFOs or small buffers.

Unique Advantages

• Balanced logic and memory: 8,064 logic elements combined with approximately 0.295 Mbits of on-chip RAM enable compact implementations of moderate-complexity designs.
• Substantial I/O capacity: 141 I/Os provide flexibility for interfacing with multiple peripherals, sensors and board-level signals.
• Standard surface-mount package: 208-BFQFP footprint (208-PQFP, 28×28) simplifies PCB layout and assembly for commercial products.
• Low-voltage core: 1.14 V to 1.26 V supply range aligns with modern low-voltage FPGA core requirements.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet common commercial application environments.
• RoHS compliant: Conforms to RoHS environmental requirements for lead-free assembly.

Why Choose XC3S400-4PQ208C?

The XC3S400-4PQ208C offers a practical combination of logic density, embedded memory and I/O capacity in a familiar Spartan‑3 FPGA footprint. Its commercial-grade rating, surface-mount 208-BFQFP package and RoHS compliance make it suitable for a wide range of commercial electronic designs that require mid-level programmable logic resources.

Designed and manufactured by AMD, this device is appropriate for designers seeking a scalable, commercially oriented FPGA platform with clear hardware characteristics (8,064 logic elements, ~0.295 Mbits RAM, 141 I/Os) and a defined operating and power profile for integration into product development and production builds.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S400-4PQ208C.