XC3S400-4FGG456C

The XC3S400-4FGG456C is a Spartan®-3 FPGA from AMD provided in a 456-ball BGA package. It offers a balance of logic capacity, on-chip memory and I/O density for commercial-grade programmable logic designs.

With 8,064 logic elements, approximately 0.295 Mbits of embedded memory and 264 user I/Os, this device is appropriate for designs that require moderate logic capacity and significant I/O count within a surface-mount 456-FBGA (23×23) footprint.

Key Features

• Logic Capacity  896 CLBs and 8,064 logic elements provide the device's core combinational and sequential resources for implementing custom digital functions.
• Embedded Memory  Approximately 0.295 Mbits (294,912 bits) of on-chip RAM to support buffering, state storage and small data tables.
• I/O Density  264 user I/Os to support a wide range of external interfaces and peripheral connectivity in I/O‑intensive designs.
• Gate Count  400,000 gates of logic capacity for mapping complex glue logic and control functions.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match targeted power-rail designs.
• Package & Mounting  456-BBGA package (supplier device package: 456-FBGA, 23×23) in a surface-mount form factor for PCB assembly.
• Operating Range  Commercial operating temperature range from 0 °C to 85 °C, suitable for standard commercial applications.
• Compliance  RoHS compliant for use in lead-free manufacturing processes.

Typical Applications

• Custom digital logic and prototyping  Use the FPGA to implement address decoding, glue logic and prototyping tasks that require up to 8,064 logic elements and multiple I/Os.
• I/O‑intensive control systems  Leverage 264 user I/Os for control panels, I/O aggregation or board-level interface bridging where many signals must be managed.
• Embedded buffering and state machines  On-chip RAM (approximately 0.295 Mbits) supports buffering, lookup tables and finite-state machines for control and data-path tasks.

Unique Advantages

• Balanced logic and memory  A combination of 8,064 logic elements and ~0.295 Mbits of embedded RAM enables implementation of both control logic and modest data-path functions on a single device.
• High I/O count  264 user I/Os reduce the need for external I/O expanders in board-level designs that require many interface lines.
• Compact surface‑mount package  456-FBGA (23×23) package provides high pin density in a compact footprint for space-constrained PCBs.
• Commercial temperature suitability  Specified 0 °C to 85 °C operating range suits standard commercial environments and applications.
• RoHS compliance  Meets lead-free manufacturing requirements for environmental compliance.

Why Choose XC3S400-4FGG456C?

The XC3S400-4FGG456C delivers a practical combination of logic resources, embedded memory and high I/O count in a commercial-grade Spartan®-3 FPGA from AMD. Its specified core voltage range and 456-BBGA surface-mount package make it straightforward to integrate into board-level designs that need moderate logic density with significant interfacing capability.

This device suits designers and procurement teams looking for a programmable logic solution that balances capacity, I/O density and a compact package, backed by AMD's Spartan®-3 product family documentation and part numbering.

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