XC3S400-4FG456I

The XC3S400-4FG456I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD provided in a 456-BBGA package. It delivers a balanced combination of programmable logic, embedded memory, and high I/O density for industrial-grade applications.

With 8,064 logic elements, approximately 0.295 Mbits of embedded memory and 264 user I/O, this device targets designs that require flexible hardware customization within an industrial operating range and a compact surface-mount package.

Key Features

• Core Logic 8,064 logic elements (programmable logic resources) providing the basis for custom digital implementations.
• On-Chip Memory Approximately 0.295 Mbits of embedded memory (294,912 total RAM bits) for buffering, state storage, and local data handling.
• I/O Density 264 user I/O pins to support multiple external interfaces and parallel connections.
• Gate Scale Approximately 400,000 gates for mid-range complexity designs.
• Package & Mounting 456-BBGA package; supplier device package listed as 456-FBGA (23×23). Surface-mount mounting type for PCB assembly.
• Power Core voltage supply range of 1.14 V to 1.26 V for compatibility with targeted power domains.
• Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control — Use for implementing custom logic and control functions where industrial temperature range and robustness are required.
• Embedded Logic and Glue — Integrate programmable logic to consolidate functions, offload microcontroller tasks, or implement interface bridging.
• Communications and I/O Aggregation — Leverage 264 I/O pins for handling multiple serial/paralleled peripheral connections and protocol interfaces.

Unique Advantages

• Balanced Logic-to-Memory Ratio: 8,064 logic elements paired with approximately 0.295 Mbits of embedded RAM enable a range of mid-complexity functions without external memory.
• High I/O Capacity: 264 I/O pins provide flexibility for multi-channel interfaces, sensor arrays, and peripheral aggregation.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for reliable operation in temperature-demanding environments.
• Compact, High-Pin Package: 456-BBGA (456-FBGA 23×23) delivers high pin-count connectivity in a surface-mount form factor suitable for dense PCB layouts.
• Low-Voltage Core Compatibility: Core supply range of 1.14 V to 1.26 V for integration with modern power architectures.
• RoHS Compliant: Meets environmental compliance requirements for restricted substances.

Why Choose XC3S400-4FG456I?

The XC3S400-4FG456I combines a practical mix of programmable logic, embedded memory, and extensive I/O in a compact 456-BBGA package tailored for industrial-grade applications. Its specifications make it well suited to designers seeking flexible hardware implementation, moderate gate and memory capacity, and a high count of external interfaces within a controlled thermal range.

This device fits designs where mid-range logic density, on-chip RAM, and robust operating temperature are required, offering long-term value through a stable feature set and compliance with RoHS environmental standards.

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