XC3S400-4FG320I

The XC3S400-4FG320I is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD, delivered in a 320-ball BGA package. It combines 8,064 logic elements, approximately 294,912 bits of on-chip RAM and 221 general-purpose I/O pins to address designs that require moderate logic capacity and substantial external connectivity within an industrial temperature range.

Key Features

• Core Logic 8,064 logic elements and a gate count of 400,000 provide capacity for custom digital logic implementations.
• Embedded Memory Total on-chip RAM of 294,912 bits for local buffering, lookup tables and state storage.
• I/O Resources 221 user I/O pins enable broad interfacing to peripherals, sensors and external devices.
• Power Supported supply voltage range of 1.14 V to 1.26 V for the device core.
• Package & Mounting 320-BGA package (supplier device package: 320-FBGA, 19×19) with surface-mount mounting type for compact board implementations.
• Temperature & Grade Industrial-grade device rated for operation from –40°C to 100°C for deployment in demanding environments.
• Compliance RoHS-compliant construction.

Typical Applications

• I/O-intensive embedded systems — Use the 221 I/O pins to connect multiple sensors, interfaces and external peripherals while implementing custom control logic.
• Industrial control and automation — Industrial-grade temperature range (–40°C to 100°C) and robust logic capacity make the device suitable for factory and process-control electronics.
• Prototyping and custom logic — 8,064 logic elements and 400,000 gates provide resources for prototyping custom digital functions and algorithm offload.
• On-chip buffering and local storage — Nearly 295k bits of embedded RAM support local buffering, FIFOs and small data tables for low-latency processing.

Unique Advantages

• Balanced logic and memory resources: 8,064 logic elements paired with 294,912 bits of RAM allow designers to implement both control and data-path functions on a single device.
• Extensive I/O capacity: 221 I/O pins reduce the need for external interface components and simplify board routing for multi-peripheral systems.
• Industrial temperature rating: Operating range from –40°C to 100°C supports deployment in temperature-challenging environments.
• Compact BGA footprint: 320-BGA (320-FBGA, 19×19) enables high-density board layouts while maintaining surface-mount assembly compatibility.
• RoHS compliance: Environmentally compliant construction helps meet regulatory and manufacturing requirements.

Why Choose XC3S400-4FG320I?

The XC3S400-4FG320I positions itself as a practical, industrial-grade FPGA option for designs that need a balance of logic capacity, embedded memory and extensive I/O in a compact BGA package. Its specifications—8,064 logic elements, nearly 295k bits of on-chip RAM, 221 I/Os and a wide operating temperature range—make it suitable for embedded systems, industrial control and prototyping projects where reliable operation across temperature and board space constraints matter.

Manufactured by AMD, this Spartan®-3 device offers a clear set of capabilities for engineers seeking a moderate-density FPGA with substantial I/O and operating range, enabling streamlined BOMs and reduced external component count in medium-complexity designs.

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