XC3S250E-5VQG100C

The XC3S250E-5VQG100C is a commercial-grade Field Programmable Gate Array (FPGA) from AMD designed for mid-range programmable-logic applications. It combines a defined logic capacity, embedded memory, and a moderate I/O count in a compact surface-mount 100-TQFP package.

With approximately 5,508 logic elements, about 0.22 Mbits of on-chip RAM, and 66 I/O pins, this device is suited to commercial electronic designs that require configurable digital logic and local memory in a compact form factor.

Key Features

• Logic Capacity  Approximately 5,508 logic elements for implementing custom digital logic and combinational/sequential functions.
• On-Chip Memory  Approximately 221,184 bits (≈0.22 Mbits) of embedded RAM for small data buffers, FIFOs, and state storage.
• I/O Resources  66 general-purpose I/O pins to interface with peripherals, sensors, and other digital subsystems.
• Gate Count  Approximately 250,000 gates as an additional sizing metric for system partitioning and resource planning.
• Power  Core voltage supply range of 1.14 V to 1.26 V for defined power budgeting and supply design.
• Package & Mounting  100-TQFP (supplier device package: 100‑VQFP, 14×14) surface-mount package for compact PCB implementations.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation; RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Provides mid-range programmable logic and local memory for control and data processing tasks in commercial electronic products.
• I/O Control and Interface  Use the 66 I/O pins to implement protocol bridging, signal conditioning logic, and peripheral interfacing in compact designs.
• Custom Logic and Glue Functions  Implement custom glue logic, state machines, and small accelerators using the device’s logic elements and embedded RAM.

Unique Advantages

• Balanced Logic and Memory:  Approximately 5,508 logic elements paired with ~0.22 Mbits of on-chip RAM enables both logic implementation and temporary data storage without external memory for many mid-range tasks.
• Defined I/O Capacity:  66 I/O pins support a range of peripheral and signal-interface requirements while keeping board-level routing manageable.
• Compact Surface-Mount Package:  100-TQFP (100‑VQFP, 14×14) form factor allows integration into space-constrained PCBs and standard assembly processes.
• Predictable Power Requirements:  A narrow core voltage window (1.14 V to 1.26 V) simplifies power-supply design and margining for the core domain.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation and RoHS compliant for commercial product deployment.

Why Choose XC3S250E-5VQG100C?

The XC3S250E-5VQG100C positions itself as a practical, mid-range FPGA option for commercial designs that need a balance of programmable logic, embedded RAM, and I/O capability in a compact, surface-mount package. Its defined gate and logic-element metrics, combined with on-chip memory and 66 I/O pins, make it suitable for designs that require configurable digital logic and modest data buffering without extensive external resources.

This device delivers predictable electrical and thermal characteristics—documented core voltage range and a commercial operating temperature window—making it straightforward to plan power, thermal, and PCB integration for production designs.

Request a quote or submit a product inquiry for the XC3S250E-5VQG100C to discuss availability, pricing, and ordering details.