XC3S250E-5PQ208C

The XC3S250E-5PQ208C is a Spartan®-3E field programmable gate array (FPGA) in a 208-pin BFQFP package designed for commercial applications. It provides a balance of on-chip logic, embedded memory and I/O capacity for applications that require mid-range gate density and flexible I/O interfacing.

Key silicon characteristics include 5,508 logic elements, approximately 0.22 Mbits of embedded RAM, 158 user I/Os and an operating voltage window of 1.14 V to 1.26 V, making the device suitable for a variety of general-purpose digital designs within a commercial temperature range.

Key Features

• Core Logic 5,508 logic elements supporting complex combinational and sequential logic implementation; device gate count listed as 250,000 gates.
• Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 bits) for buffering, FIFOs, and small data storage requirements.
• I/O Capacity 158 user I/Os suitable for parallel interfaces, control signals and peripheral connections.
• Power Supply Supported core voltage range from 1.14 V to 1.26 V for compatibility with targeted power domains.
• Package and Mounting 208-pin BFQFP surface-mount package (supplier package: 208-PQFP 28×28) for PCB-mounted designs.
• Operating Range Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Compliance RoHS compliant for environmental regulatory requirements.

Typical Applications

• Embedded Control and Glue Logic Implement glue logic, state machines and peripheral control in systems that require up to 158 I/O signals and midsize logic capacity.
• Data Buffering and Simple Packet Processing Use on-chip RAM and logic to implement FIFOs, small buffers and timing-critical data paths.
• Interface Bridging Bridge between digital buses or add custom I/O functions where a mix of general-purpose I/O and moderate logic resources is needed.

Unique Advantages

• Balanced Logic and Memory: 5,508 logic elements paired with approximately 0.22 Mbits of embedded RAM enable compact implementations without external memory for many use cases.
• Generous I/O Count: 158 user I/Os allow integration of multiple peripherals and parallel interfaces directly on-chip, reducing external glue components.
• Compact, PCB-Friendly Package: 208-pin BFQFP surface-mount package supports dense board layouts while keeping package height and footprint suitable for many commercial products.
• Defined Commercial Temperature Range: Rated for 0 °C to 85 °C operation, aligning with standard commercial electronics deployment.
• Regulatory Readiness: RoHS compliance simplifies environmental qualification for product assemblies.

Why Choose XC3S250E-5PQ208C?

The XC3S250E-5PQ208C positions itself as a commercially graded, mid-range FPGA offering a practical combination of logic, embedded memory and I/O resources. Its specifications make it well suited to designers who need to consolidate discrete logic, implement control and interfacing functions, or add moderate packet/buffer handling without resorting to larger, more costly devices.

For teams building commercial electronics that require predictable operating conditions and RoHS compliance, this Spartan®-3E device offers a straightforward path to integrate programmable logic into board-level designs while keeping power-domain and package considerations well defined.

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